Siliconware Precision Industries Co., Ltd.

Mediatek Corporation

Mediatek Singapore Pte. Ltd.

Hiwin Mikrosystem Corporation

Chien-Cheng Lin

Chih-Hsien Chiu

Tsung-Hsien Tsai

Heng-Cheng Chu

Wen-Jung Tsai

Ming-Da Tsai

Chia-Yang Chen

Hsin-Lung Chung

Chao-Ya Yang

Ming-Fan Tsai

Ko-Wei Chang

Yude Chu

Yangjian Chen

Chien-Wei Tseng

Albert Chia-Wen Jerng

Ian Tseng

Bernard Mark Tenbroek

Chih-Yuan Shih

Yueh-Chiung Chang

Tsung-Li Lin

Chi-Pin Tsai

Wen-Kai Li

Siang-Yu Lin

Chih-Wei Chen

Chia-Hsin Wu

George Chien

Li-Fen Liao

Jui-Chih Kao

Tsung-Hsien Hsu

Yu-Wei Yeh

Hui-Hsien Liu

Chih-Ming Cheng

Shun-Yu Chien

Chin-Chiang He

Fang-Yue Wang

An electronic package is provided, in which an electronic element is disposed on a carrier structure, and an interposer is stacked on the electronic element. Further, a wire is connected to the interposer and grounds the carrier structure, such that the wire and the interposer surround the electronic element. Therefore, the wire can be used as a shielding element when the electronic package is in operation to prevent the electronic element from being subjected to external electromagnetic interference.

Electronic package including an interposer stacked on an electronic element and manufacturing method thereof

An electronic package is provided and includes at least one electronic element, at least one first conductive structure and a second conductive structure disposed on one side of a carrier structure with at least one circuit layer, and an encapsulation layer covering the electronic element, the first conductive structure and the second conductive structure, where the first conductive structure is exposed from the encapsulation layer to externally connect required elements according to functional requirements.

Electronic package and manufacturing method thereof

An electronic package is provided, which includes a plurality of electronic components encapsulated by an encapsulation layer. A spacer is defined in the encapsulation layer and located between at least two adjacent electronic components of the plurality of electronic components, and a recess is formed in the spacer and used as a thermal insulation area. With the design of the thermal insulation area, the plurality of electronic components can be effectively thermally insulated from one another to prevent heat generated by one electronic component of high power from being conducted to another electronic component of low power that would thermally affect the operation of the low-power electronic component. A method for manufacturing the electronic package is also provided.

Electronic package and method for manufacturing the same

An electronic package and a manufacturing method of the electronic package are provided, in which an electronic component is arranged on a wiring structure and covered with a packaging layer, and a frame body that does not contact the wiring structure nor cover the electronic component is embedded in the packaging layer.

An electronic device is provided, in which an antenna module for receiving and transmitting radiation signals is disposed on a mounting surface of a circuit board, and an inner layer of the circuit board is formed with a ground surface to arrange a strip-shaped ground circuit along the edges of the ground surface so that the ground circuit occupies at most 50% of the area of the ground surface to improve antenna radiation efficiency.

Electronic device and circuit board thereof

An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.

Method for fabricating electronic package structure

An electronic package structure is provided, including a substrate, a package encapsulant disposed on the substrate, and an antenna structure corresponding to a disposing area of the package encapsulant and having a first extension layer, a second extension layer disposed on the substrate, and a connection portion disposed between and electrically connected to the first extension layer and the second extension layer. Through the formation of the antenna structure on the disposing area of the package encapsulant, the substrate is not required to be widen, and, as such, the electronic package structure meets the miniaturization requirement.

Electronic package structure

Electronic package structure and fabrication method thereof

A quadrature transmitter includes a first and second matched transmitter path. Each transmitter path receives respective sets of quadrature baseband signals. At least one local oscillator port receives respective sets of quadrature LO signals. Mixer stage(s) respectively multiply the sets of quadrature baseband signals with the respective sets of quadrature LO signals to produce a respective output radio frequency signal. A combiner combines the output RF signals. The first set of quadrature signals is a substantially 45&#xb0; phase shifted version of the second set of quadrature signals; and the first set of quadrature LO signals is a reverse substantially 45&#xb0; phase shifted version of the second set of quadrature LO signals. A baseband error correction circuit corrects a phase error between the quadrature baseband signals at baseband and a LO error correction circuit corrects a phase error between the quadrature baseband signals at a LO frequency.

Quadrature transmitter, wireless communication unit, and method for spur suppression

A matching network circuit and an associated apparatus are provided. The matching network circuit includes a matching unit coupled between a common path port and a first path port of the matching network circuit, and an impedance unit coupled between the common path port and a second path port of the matching network circuit. The common path port is utilized for connecting the matching network circuit to a common path, the first path port is utilized for connecting the matching network circuit to a first device on a first path, and the second path port is utilized for connecting the matching network circuit to a second device on a second path. The matching unit is arranged for performing impedance matching between the common path port and the first path port, and the impedance unit is arranged for performing impedance matching between the common path port and the second path port.

Matching network circuit, and associated apparatus with shared matching network circuit

An electronic package is provided, which includes: a substrate; at least an electronic element disposed on the substrate; an antenna structure disposed on the substrate; and an encapsulant formed on the substrate for encapsulating the electronic element and the antenna structure. Therein, the antenna structure has an extension portion and a plurality of support portions connected to the extension portion for supporting the extension portion over the substrate so as to save the surface area of the substrate, thereby meeting the miniaturization requirement of the electronic package.

Electronic package and fabrication method thereof

A harmonic-rejection mixer apparatus includes a mixing circuit and a combining circuit. The mixing circuit receives mixes an input signal and a first local oscillator (LO) signal to generate a first output signal, and mixes the same input signal and a second LO signal to generate a second output signal, wherein the first LO signal and the second LO signal have a same frequency but different phases. The combining circuit combines the first output signal and the second output signal, wherein harmonic rejection is at least achieved by combination of the first output signal and the second output signal.

Phase-rotated harmonic-rejection mixer apparatus

A package having ESD (electrostatic discharge) and EMI (electromagnetic interference) preventing functions includes: a substrate unit having a ground structure and an I/O structure disposed therein; at least a semiconductor component disposed on a surface of the substrate unit and electrically connected to the ground structure and the I/O structure; an encapsulant covering the surface of the substrate unit and the semiconductor component; and a metal layer disposed on exposed surfaces of the encapsulant and side surfaces of the substrate unit and electrically insulated from the ground structure, thereby protecting the semiconductor component against ESD and EMI so as to improve the product yield and reduce the risk of short circuits.

Fabrication method of package having ESD and EMI preventing functions

A frequency tunable filter and an associated apparatus are provided, where the frequency tunable filter may include a plurality of ports including an input port and an output port, and may further include an inductor-capacitor (LC) resonator, a switching unit that is coupled between the LC resonator and a ground terminal of the frequency tunable filter, and a resonance adjustment unit that is coupled between the LC resonator and the ground terminal. For example, the LC resonator may include a first terminal coupled to each of the input port and the output port, and may further include a second terminal, the switching unit may selectively provide a conduction path between the second terminal of the LC resonator and the ground terminal, and the resonance adjustment unit may selectively change a resonance characteristic of the LC resonator.

Frequency tunable filter with voltage stressed relaxed switch, and associated apparatus

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Taichung, Taiwan

Chien-Cheng Lin