Opto Tech Corporation

Chien-Chen Hung

Hung-Tung Wang

Chih-yuan Yen

Huai-Ku Chung

Jin-Shown Shie

Shun-Chih Chen

Cheng-Wei Yang

Shun-Lih Tu

Shih-Han Yu

Tsu-An Han

Chih-Hung Chuang

Mei-hsueh Peng

Chun-Fang Hsiao

Chia-Feng Yang

Fang-Shih Chuang

According to the method, a trench structure is formed in a substrate. LED arrays and driver ICs are located in the corresponding trenches. An insulating layer is formed over the substrate, the LED arrays and the driver ICs. A photolithography process forms an electrical connection structure between the LED arrays and the driver ICs. Then, a die-cutting process cuts out individual units. These units are fixed in a PCB and an electrical connection structure is formed between these units and input/output pins on the PCB.

LED array package structure and method thereof

A light emitting element array module includes a board; a silicon base having a first side, a second side opposite to the first side and adhered to the board, a third side having a first angle with the second side, a fourth side substantially in parallel with the first side and having a second angle with the third side, and a fifth side having a third angle with the fourth side; a chip having a first main surface formed with at least one light emitting element array and at least one pad array, and a second main surface adhered to the board; a driving device adhered to the first side of the silicon base; and a plurality of metal wires for connecting the pad array to the driving device.

Light emitting element array module and printer head and micro-display using the same

A light emitting diode (LED) includes a heat dissipation structure characterized by having a heat dissipating fluidic coolant filled in a hermetically sealed housing where at least one LED chip mounted on a metallic substrate is dwelled inside. The heat dissipation structure is configured with a metallic wall erected from the metallic substrate, which is used to hold a transparent cap of the sealed housing in correct position. Furthermore, the erected wall surrounds in proximity with the at least one LED chip, so that the joule heat generated therefrom can be quickly spread out, through the heat dissipating fluidic coolant, to the erected wall, and then diffused along the wall down to the metallic substrate which adjoins with a larger external heat sink for draining the heat, thus preventing the at least one LED from overheating. The other characteristic of the invention resides in that the transparent cap of the sealed housing is made of transparent materials, wherein a convex portion contacted with the heat dissipating fluidic coolant is formed on the inner surface of the transparent cap. Hence if there is any air bubble existing inside the housing due to insufficient filling, it will not dwell in the field of line-of-sight due to buoyancy. The possibility of scattering the LED light due to existing of the bubbles therefore is avoided.

Heat dissipation structure for solid-state light emitting device package

A smart light emitting diode cluster and system includes a central processing unit (CPU) and a plurality of LED cluster strings, each comprising a plurality of LED cluster connected in series. Each LED cluster includes an LED drive circuit and a plurality of LEDs. The CPU receives external input image signal, and then desired control signal and image data are sent to the LED cluster strings by appropriate processing. The control signal is used to switch the LEDs in the cluster to generate desired image and related color variation. The control signal and image data are transferred to the next LED cluster by the present LED drive circuit. In this manner, the control signal and image data are progressively transferred from the first to the last cluster so that a whole image with color variation can be displayed by all the LEDs in the system.

Smart light emitting diode cluster and system

Growing community of inventors

Hsinchu, Taiwan

Chien-Chen Hung