Inventec Corp.

Acer Inc.

Inventec (pudong) Technology Corporation

Phision Electronic Corp

Chien-An Chen

Kai-Yang Tung

Chih-Chien Lin

Wei-Ta Shih

Yi-Ling Chen

Yen-Cheng Lin

Chun-Ying Yang

Ming-Hung Shih

Khein-Seng Pua

Mao-Ching Lin

Shih-Chung Hsu

Chien-Wei Wu

Hsueh-Hui Chang

Hui-Min Feng

Wei-Chia Chao

A magnetic valve and a fluid supply system using the same are provided. The fluid supply system includes a flow channel and the magnetic valve. The magnetic valve penetrates through a pipe wall of the flow channel, and includes a driving unit, a first magnet and a second magnet, a cover plate, a first and second spools. A first leaning portion of the first spool is disposed at one end of a first sheath portion. The first sheath portion has a first outlet opening. The second magnet is disposed on a surface of the first leaning portion facing to the cover plate. The second spool sleeves the first spool and has a second outlet opening. The first spool rotates relative to the second spool through a magnetic force to control an overlapping area of the first and second outlet openings, so as to control a flow rate.

Magnetic valve and fluid supply system using the same

A heat exchanger comprises a base portion and a plurality of fins. The fins are disposed on the base portion in parallel along a processing direction. Each fin has a processing surface far away from the base portion. The processing surfaces sunken to form at least one groove, and the groove extends along a grooving direction which intersects with the processing direction. Furthermore, each fin has two upper valley sides at the groove, and the two upper valley sides connect the processing surface. The two upper valley sides and the processing surface form an obtuse angle. The structure of the heat exchanger can prevent processing waste filling in the passages between fins.

Heat exchanger and method for fabricating the same

A server system has an air inlet side and an air outlet side. The server system includes two server rack modules arranged side by side and a controller electrically connected to the server rack modules. Each server rack module includes a cabinet having a first side close to the air inlet side, multiple server hosts detachably disposed in the cabinet and a fan component. The fan component, disposed at the first side, includes multiple fans electrically connected to the controller. The first side of one of the cabinets abuts against the second side of the other cabinet. When the fan components operate, an air flow is formed in the cabinets. The server hosts are located in the flow path of the air flow. When one of the fans is failed, the controller is adapted for increasing a rotational speed of the fan component close to the air outlet side.

Server system and method for controlling the same

A heat dissipation control system comprises a sensing unit, an artificial neural network computing unit, and two heat dissipation units. The artificial neural network computing unit performs computation for controlling based on a plurality of electronic-device temperatures sent out by the sensing unit. The computation for controlling performs a back propagation algorithm on an objective function which is defined a as the square of an error function. Accordingly, cooling effects suitable for the heat dissipation units are generated in order to achieve an optimum heat dissipation effect.

Heat dissipation control system and control method thereof

A server rack heat dissipation system for a server including an electronic component comprises a first and a second heat dissipation assembly. The first heat dissipation assembly includes a first heat exchanger and a first pipeline. The first heat exchanger is inside the server rack and in thermal contact with the electronic component. The first pipeline is in thermal contact with the first heat exchanger and has a first coolant. The second heat dissipation assembly includes a second heat exchanger. The second heat exchanger is inside the server rack and in thermal contact with the first pipeline. The second heat exchanger can remove the heat of the electronic component in the first coolant in advance. Accordingly, the time of the first coolant being maintained in a vapor phase can be shortened, so that a power the fluid driving device used for driving the first coolant is reduced.

Heat dissipation system

A cooling coolant pipe of a server cabinet includes multiple tube bodies interconnected in series and at least one adjustable valve. In each of the tube bodies a first chamber and a second chamber that are adjacent to and separated from each other, the second chambers of the two adjacent tube bodies are in communication with each other, and a wall surface of each of the tube bodies has at least one connection port in communication with the first chamber. The adjustable valve is disposed in one of the tube bodies. The first chamber in each of the tube bodies is in communication with the second chamber in the tube body through the adjustable valve. In this way, the adjustable valve adjusts the flow rate of a cooling fluid flowing from the second chamber to the first chamber.

Server cabinet coolant distribution system

A cooling module applicable in an electronic device is provided. The electronic device includes a plurality of first heat sources and a plurality of second heat sources. The cooling module includes a cooling loop and a plurality of heat pipes. The cooling loop includes a plurality of cooling units. The cooling units are connected in series through a plurality of connection tube and each cooling unit is thermally coupled to one of the first heat source. The heat pipes are thermally coupled to the second heat sources and the cooling units. When the cooling unit is in failure, the cooling units can be directly removed and replaced. Also, the second heat sources of the electronic device are capable of exchanging heat with the cooling unit through the heat pipe.

Cooling module

A cooling system for a server includes at least one radiator and at least one cooling plate that are installed in a server cabinet, a cooling assembly, a storage tank, and a heat exchanger. The cooling assembly is connected to the radiator, and is carried with a first cooling fluid therein. The storage tank is connected to the cooling plate, and is carried with a second cooling fluid therein. The first cooling fluid enters the heat exchanger through the radiator, and the second cooling fluid enters the heat exchanger through the cooling plate. The first cooling fluid and the second cooling fluid perform heat exchange in the heat exchanger, so as to reduce the temperature of the second cooling fluid, thus reducing the required energy enabling the second cooling fluid to return to a set temperature.

Cooling system for server and cooling method for electronic apparatus

A separable liquid-cooling heat-dissipation module has a first flow pipe, a second flow pipe, and a plurality of heat conduction blocks. The second flow pipe is set on a top end of the first flow pipe. A bottom end of the second flow pipe has a gap, so that a heat-insulating structure is formed between the first flow pipe and the second flow pipe. The heat conduction blocks are installed on both sides of the first flow pipe and the second flow pipe. A combination of the first flow pipe, the second flow pipe, and the heat conduction blocks provides a modular heat-dissipation structure and also achieves effects of heat-dissipation and energy-saving.

Separable liquid-cooling heat-dissipation module

A modulized heat-dissipation control method for a datacenter is provided. In this method, a temperature sensor is used to sense inner temperatures of multiple servers and CPU temperatures in the multiple servers. If any one of the CPU temperatures is abnormal, a flow of a first coolant is adjusted. If any one of the inner temperatures is abnormal, a rotating speed of a fan module is adjusted. If the rotating speed of the fan module has reached its maximum, a flow of a second coolant is adjusted.

Modulized heat-dissipation control method for datacenter

A cooling circulation system of a server includes a cabinet assembly, a plurality of first fan modules, a plurality of second fan modules, and two air guide hoods. The first fan modules and the second fan modules are disposed on the cabinet assembly. The first fan modules blow a first airflow towards a first direction, and the second fan modules blow a second airflow towards a second direction. The air guide hoods are respectively installed on two ends of the cabinet assembly. The first airflow and the second airflow join each other through the air guide hoods, so as to form a cooling circulation loop inside the cabinet assembly.

Cooling circulation system of server

A server cabinet includes a rack, at least one assembling frame, a radiator and at least one fan. The rack has a first frame and a second frame opposite to each other. The assembling frame and the radiator are mounted on the first frame in sequence. The radiator transfers a coolant to flow inside a plurality of heatsink fins thereof in a circulating manner. The fan is mounted in the assembling frame, and the fan guides an airflow to flow into the first frame from the radiator, and blows the airflow in the rack to the second frame, thus lowering the temperature inside the rack.

Server cabinet

A server rack includes a cabinet, at least one fan, and at least one circuit board, in which the cabinet has a first side surface and a second side surface arranged along a first direction and opposite to each other. The fan is installed on the first side surface of the cabinet and blows an airflow in the first direction, the circuit board is installed in the cabinet along the second direction, and the second direction and the first direction are perpendicular to each other, so the airflow generated by the fan is blown to the circuit board, thereby performing heat dissipation.

Server rack

An adjustable coolant quick coupler has a coolant supplier seat and a transmission seat that can be optionally connected or disconnected. The coolant supplier seat has a regulator assembly. The regulator assembly is able to adjust quantity of flow-in coolant and quantity of flow-out coolant. When the coolant supplier seat is connected to the transmission seat, the coolant can flow automatically from the coolant supplier seat to the transmission seat, so as to cool down electronic components inside a rack. When the coolant supplier seat is disconnected from the transmission seat, the coolant instantly stops flowing into the transmission seat. Because of the quick coupler, the rack installed inside a narrow space is convenient to set up or disassemble. Furthermore, by adjusting the quantity of flow-in coolant and the quantity of flow-out coolant, the electronic components can have a better effect of heat-dissipation.

Adjustable coolant quick coupler

A quick coupler has a coolant supplier seat and a transmission seat that can be optionally connected or disconnected. When the coolant supplier seat is connected to the transmission seat, the coolant can flow automatically from the coolant supplier seat to the transmission seat, so as to cool down electronic components inside a rack. When the coolant supplier seat is disconnected from the transmission seat, the coolant instantly stops flowing into the transmission seat. Because of the quick coupler, the rack installed inside a narrow space is convenient to set up or disassemble.

Growing community of inventors

Taipei, Taiwan

Chien-An Chen