Visera Technologies Company Limited

Omnivision Technologies, Inc.

Taiwan Semiconductor Manufacturing Comp. Ltd.

Visera Technology Company Limited

Chieh-Yuan Cheng

Shin-Chang Shiung

Tzy-Ying Lin

Hung-Yeh Lin

Tzu-Han Lin

Han-Lin Wu

Li-Hsin Tseng

San-Yuan Chung

Yu-Kun Hsiao

Fu-Tien Weng

Pai-Chun Peter Zung

Huang-Jen Chen

Same-Ting Chen

Wen-Rong Huang

Cheng-Shien Lee

Chin-Wang Hu

Hsiang-Chien Hsu

An image sensing device includes: an active layer with a plurality of photo-sensing elements; a color pattern disposed over one of the photo-sensing elements, wherein the color pattern has a color selected from the group consisting of red (R), green (G), and blue (B); a microlens disposed on the color pattern; and a transmissive pattern being adjacent to the color pattern and over another one of the photo-sensing elements, wherein the transmissive pattern includes a color filter portion and a microlens portion, and an absolute value of a difference of refractive indexes between the microlens and the color pattern is less than 0.3, and there is no difference of refractive indexes between the microlens portion and the color filter portion of the transmissive pattern.

Image sensing device and method for fabricating the same

A camera module and a fabrication method thereof are provided. The camera module includes a lens structure and an image sensor device chip disposed under the lens structure. The lens structure includes a transparent substrate and a lens disposed on the transparent substrate. A spacer is disposed on the transparent substrate to surround the lens, wherein the spacer contains a base pattern and a dry film photoresist. The method includes forming a base pattern on a carrier and attaching a dry film photoresist on the carrier. The dry film photoresist is planarized by a lamination process and then patterned to form a spacer. A transparent substrate having a plurality of lenses is provided. The spacer is stripped from the carrier, attaching on the transparent substrate to surround each of the lenses, and then bonded with image sensor device chips.

Methods of fabricating camera module and spacer of a lens structure in the camera module

The invention provides an encapsulant module for an image sensor device. The module includes an outer frame, a set of optical elements, and an opaque coating. The outer frame includes an enclosing wall and a first opening surrounded by the enclosing wall. The set of optical elements connects to and is disposed in the enclosing wall. The opaque coating overlies the enclosing wall.

Encapsulant module with opaque coating

Camera module and spacer of a lens structure in the camera module

The invention provides an image sensor device. The image sensor device includes a chip package and an opaque coating. The chip package includes an image sensor array chip, wherein a set of optical elements connect to the image sensor array chip, and an outer frame shielding the optical elements. The opaque coating overlies the outer frame.

Image sensor device with opaque coating

A method for fabricating a color filter structure includes: providing a base layer; forming a first colored layer on the base layer; patterning the first colored layer to form a pair of first colored patterns, a first opening between the first colored patterns, and a second opening adjacent to the first colored patterns; forming a first dielectric layer on the first colored patterns and the base layer exposed by the first and second openings; forming a second colored layer on the first colored patterns and the first dielectric layer; patterning the second colored layer to form a second colored pattern in the first opening; forming a second dielectric layer on the first dielectric layer and the second colored pattern; forming a third colored layer on the second dielectric layer; and patterning the third colored layer to form a third colored pattern in the second opening.

Color filter structure and method for fabricating the same

The invention provides a method for fabricating a camera module. An exemplary embodiment of the method for fabricating a camera module comprises providing plurality of lens sets. A dry film layer is formed on the plurality of lens sets. The dry film layer is patterned to form a plurality of dry film patterns respectively attaching to a plurality of lens sets. The plurality of lens sets are separated. A lens set separated from the plurality of lens sets is bonded to an image sensor device chip. The dry film pattern on the lens set is removed.

Method for fabricating camera module

The invention provides a compact camera module. The compact camera module includes an image sensing device, a set of optical elements, and a zooming device. The set of optical elements connects to the image sensing device, and comprises a lens set. The zooming device connects to the set of optical elements for adjusting a distance between the lens set and the image sensing device. The zooming device directly electrically joins with the image sensing device.

Compact camera module

According to embodiments of the invention, a lens assembly and method for forming the same is provided. The method includes providing a first lens layer having a first transparent substrate and a first lens on the first transparent substrate, providing a second lens layer having a second transparent substrate and a second lens on the second transparent substrate, forming a spacer structure between the first lens layer and the second lens layer, and thinning the first transparent substrate to a first thickness after the spacer is formed.

Lens assembly and method for forming the same

Electronic device packages with electromagnetic compatibility (EMC) coating thereon are presented. An electronic device package includes a chip scale package having a CMOS image sensor (CIS) array chip and a set of lenses configured with an aperture. An encapsulation is molded overlying the chip scale package. A shield is atop the encapsulation. A frame fixes the set of lenses to the encapsulation. An electromagnetic compatibility (EMC) coating is formed on the encapsulation to prevent electromagnetic interference.

Electronic device package with electromagnetic compatibility (EMC) coating thereon

A method for forming a light-transmitting region comprises providing a support feature. A sacrificial layer is formed over a portion of the support feature, wherein the sacrificial layer comprises an energy-induced swelling material. A light-blocking layer is conformably formed over the support feature to cover the sacrificial layer and the support feature. The support feature, the sacrificial layer, and the light-blocking layer are subjected to an energy source to swell the sacrificial layer until bursting to thereby delaminate a portion of the light-blocking layer from the support feature and leave a light-transmitting region exposed with a portion of the support feature in the light-blocking layer. A gas flow or scrub cleaning force is provided to clean up the light-transmitting region and a top surface of the light-blocking layer remains over the support feature.

Method for forming light-transmitting regions

A method of repairing opaque defects on a photolithography mask avoids damage to the mask substrate while providing improved repair results. A chrome mask pattern is first covered with a layer of carbon, following which the entire mask is covered with a layer of photoresist. Portions of the photoresist are then etched away to expose the defect, while other portions remain covering the carbon. The defect is etched away while the carbon protects the adjacent areas of the chrome mask pattern. Following removal of the defect, the remaining areas of photoresist and carbon are then removed.

Method for repairing opaque defects in photolithography masks

A new sequence and chemical composition for cleaning the surface of a halftone shift masks that use MoSiON as shifter material is provided. For purposes of repair or rework, the pellicle is removed from the mask so that the mask can be accessed. After the rework or repair has been completed, a new clean process is performed, for the new clean process the sequence of steps that is conventionally performed has been modified. After the new clean process has been completed, the pellicle is reinstalled over the surface of the mask.

Growing community of inventors

Hsinchu, Taiwan

Chieh-Yuan Cheng