Everlight Electronics Co., Ltd.

Chieh-Yu Kang

Hao-Yu Yang

Kuang-Mao Lu

Ru-Shi Liu

Chung-Chuan Hsieh

Chih-Min Lin

Yi-Ting Huang

Chun-Chih Liang

Shu-Fen Hu

Chih-Hao Hsu

Mu-Huai Fang

Ke-Hao Pan

Ho Chang

Jian-Hong Fan

Veeramani Rajendran

Jing-Hong Lai

Yan-Shen Lin

Gabriel Nicolo A De Guzman

Sheng-Wei Chou

Shih-Wen Lai

Chia-Wei Yang

Yi-Sheng Lan

Chia-Fong Chou

Chien-Nan Liu

Jen-Hao Pan

Tzu-Lun Tseng

Teng-Wei Chen

Chih-Ming Ho

Ding-Hwa Cherng

Wen-Chueh Lo

Yu-Da Lee

Han-Chang Pan

A proximity sensing device which is disposed under the OLED panel and has an emitting module and a receiving module, is provided. The emitting module can emit an invisible light which has a peak wavelength not less than 1000 nm. The receiving module is disposed adjacent to the emitting module and can receive a reflecting light from the reflected invisible light. Therefore, the invisible light passing through the OLED panel will not cause a bright spot on the panel.

Proximity sensing device

The present invention provides a package support structure and a light emitting device including same. The package support structure includes: a housing which comprises a light emitting surface, a backlight surface, a bottom surface and a groove; a conductive support which is partially covered by the housing and includes a first lead and a second lead that are separated from each other, where each of the first lead and the second lead includes an electrode portion and a bent portion, the electrode portion is exposed from the housing through the groove, and the bent portion extends outward from the electrode portion beyond the housing and bends toward the bottom surface of the housing; where one of the first lead and the second lead further includes a heat radiation portion, the heat radiation portion extend outward from the electrode portion and is exposed from the backlight surface of the housing. The package support structure provided in the present invention achieves the effect of reducing an upper piece error and the purpose of effectively removing the heat energy.

Package support structure and light emitting device including same

The present invention relates to a phosphor, a method for preparing the phosphor, an optoelectronic component, and a method for producing the optoelectronic component. The phosphor has the following general formula: LaGaGeO: 3xA, yCr, 5zB, where x, y, and z do not equal to 0 simultaneously; A represents at least one of Gd and Yb; B represents at least one of Sn, Nb, and Ta. For the phosphor, its emission spectrum is within a red visible light region and a near-infrared region when excited by blue visible light, purple visible light or ultraviolet light; and it has a wide reflection spectrum and a high radiant flux. Therefore, it can be used in optoelectronic components such as LEDs to meet requirements of current medical testing, food composition analysis, security cameras, iris/facial recognition, virtual reality, gaming notebook and light detection and ranging applications.

Phosphor, method for preparing phosphor, optoelectronic component, and method for producing optoelectronic component

The present disclosure provides an LED package structure and a method for manufacturing the LED package structure. The LED package structure includes: a chip scale package (CSP) light emitting element and a shading layer, where the CSP light emitting element includes a light emitting chip, and the light emitting chip includes an electrode group located on a bottom surface of the light emitting chip, the shading layer is disposed on a bottom surface and/or a side surface of the CSP light emitting element. An LED package structure according to the present disclosure solves a problem that the blue light leaking from the bottom surface of the LED chip interferes with the emission color of the CSP emitting device, and reduces the luminous efficiency of the emitting device.

LED package structure and method for manufacturing same

A semiconductor package structure is disclosed. The package structure includes a first substrate, a second substrate on which the first substrate is disposed, and a semiconductor chip which is disposed on the first substrate. The two substrates can include two notches or two solder receiving portions. Therefore, when the package structure is disposed on the printed circuit board (PCB), the package structure will protrude less on the surface of the printed circuit board (PCB); or, the solders on the printed circuit board (PCB) will not be shifted by the package structure.

Semiconductor package structure

Growing community of inventors

Taipei, Taiwan

Chieh-Yu Kang