Hon Hai Precision Industry Co., Ltd.

Chieh-Rung Huang

Nick Lin

Ming-Lun Szu

Yi-Feng Lo

An electrical connector ( ) includes an insulative housing ( ) having a first surface ( ) and a second surface ( ). The housing defines a plurality of passageways ( ) communicating the first surface and the second surface, each passageway receiving two opposite contacts ( ) therein. Each contact defines a base portion ( ) interferentially received in the housing, a solder portion ( ) extending from an end of the base portion, a bending portion ( ) extending from the other end of the base portion and an elastic portion ( ) extending from the distal end of the bending portion. In addition, the elastic portion defines a contacting pad ( ), which is used to electrically connect with an LGA IC module. An area of the contacting pad is less than an area of the solder portion, and a vertical projection of the contacting pad on the solder portion is entirely within the solder portion.

Electrical connector having high performance contacts

An LGA socket comprises an insulative housing defining a number of passageways therethrough and a corresponding number of terminals retained therein. Each terminal forms upper and lower spring arms partially extending beyond the corresponding passageway, a curved linking portion for connecting the upper and lower arms, and a securing arm extending from the lower arm towards the upper arm and secured to the insulative housing. The upper arm can be deformed to contact the securing arm thereby providing a short electrical path therethrough and reducing the overall height of the LGA socket.

Terminal for an LGA socket

An electrical connector (,) electrically connects a CPU (,) to a motherboard (,) and comprises a housing (,) and a plurality of contacts (,). The housing has a first face (,) for engaging the CPU, a second face (,) for attaching to the motherboard and a plurality of contact passageways (,) defined between the two faces for receiving the contacts. Each contact comprises a contact section (,) which extends beyond the first face and engages a corresponding contact of the CPU, a tail (,) received in the contact passageway, and a receiving section (,) opposite the contact section which abuts a mating face (,) of the passageway proximate to the second surface to form an arcuate receiving surface for engaging a solder ball (,). After the solder ball is heated, the tail is electrically engaged to a contact on the motherboard. Due to the configuration of the arcuate receiving space, the solder ball remains in its original position and the contact is prevented from inclining.

Growing community of inventors

Tao-Yuan, Taiwan

Chieh-Rung Huang