Advanced Optoelectronic Technology, Inc.

Chieh-Ling Chang

Chao-Hsiung Chang

Hsin-Chiang Lin

Wen-Liang Tseng

Hsing-Fen Lo

Pi-Chiang Hu

Shen-Bo Lin

An LED package structure includes a substrate, two electrodes engaged in the substrate, an LED chip, a reflective cup and an encapsulation. The substrate includes a first surface and a second surface opposite to the first surface. Each of the electrodes defines a groove. The grooves surrounding the LED chip. The LED chip is mounted on one of the electrodes and electrically connected to the two electrodes. The reflective cup is mounted on the substrate and surrounds the LED chip. The encapsulation covers the LED chip and extends in the grooves of the electrodes to prevent water/moisture from entering the LED chip.

LED package structure

A method for manufacturing an LED package includes following steps: providing a base with an LED chip mounted on the base; providing a porous carrier with a plurality of holes, and disposing the base on the porous carrier; providing a film with a phosphor layer attached on the film; providing a mold, and putting the porous carrier, the base, the LED chip, and the film into the mold; extracting air from the mold to an external environment through the holes of the porous carrier, and/or, blowing air toward the film to urge the film to move toward the LED chip, resulting in that the film is conformably attached onto the LED chip and the base; and solidifying the phosphor layer on the LED chip by means of heating whereby the phosphor is conformably and securely attached on the LED chip.

Method for manufacturing LED

A method for manufacturing an LED includes steps: providing a base and an LED chip disposed on the base; providing an optical element and disposing the optical element on the base to cover the LED chip; providing a phosphor film and disposing the phosphor film on the optical element; providing a holding plate with capillary holes and disposing the base on the holding plate; providing a mold, wherein the mold and the holding plate cooperatively form a receiving room which receives the base, the LED chip, the optical element and the phosphor film therein; extracting air from the receiving room through the capillary holes of the holding plate, and/or, blowing air toward the phosphor film, whereby the phosphor film is conformably attached onto the optical element; and solidifying the phosphor film on the optical element.

The disclosure provides a manufacturing method for an LED package. A first luminescent conversion layer comprising one first luminescent conversion element is located on an LED chip, wherein the first luminescent conversion element is precipitated via centrifugation around the LED chip without sheltering the LED chip. Thereafter, a second luminescent conversion layer is located on the first luminescent conversion layer. The second luminescent layer has a second luminescent conversion element which has an excited efficiency lower that that of the first luminescent conversion element.

Manufacturing method for LED package

A method for manufacturing an LED is disclosed. Firstly, a base with two leads is provided. The base has a cavity defined in a top face thereof and two holes defined in two lateral faces thereof. The two holes communicate the cavity with an outside environment. A chip is fixed in the cavity and electrically connected to the two leads. A cover is placed on the top face of the base to cover the cavity. An encapsulation liquid is filled into the cavity through one hole until the encapsulation liquid joins a bottom face of the cover. Finally, the encapsulation liquid is cured to form an encapsulant. A top face of the cover functions as a light emergent face of the LED.

A method for manufacturing light emitting diodes includes steps of: providing a base have an upper conductive layer and a lower conductive layer on a top face and a bottom face thereof, respectively; forming a plurality of through holes in the base; defining a plurality of grooves to divide the upper and lower conductive layers into discrete strips; forming a connection layer on an inner circumferential face of each hole to connect the opposite strips of the upper and lower conductive layers; filling a supporting layer in an upper portion of each hole; forming a reinforcing layer on the supporting layer and the upper conductive layer; fixing chips on the reinforcing layer and electrically connecting the chips with the strips of the upper conductive layer; forming an encapsulant on the reinforcing layer; and cutting the base into individual LEDs along the holes.

Method for manufacturing light emitting diode

An exemplary light emitting diode (LED) package includes a substrate having a first electrical portion and a second electrical portion formed thereon, two antioxidation layers formed on and electrically connected to the first electrical portion and the second electrical portion, respectively, and an LED chip disposed on the substrate and electrically connected to the two antioxidation layers.

Light emitting diode package and method for manufacturing the same

A light emitting diode package comprises a light emitting diode chip, a first luminescent conversion layer and a separate second luminescent conversion layer on the first luminescent conversion layer. The first luminescent conversion layer has a first luminescent conversion element surrounding the light emitting diode chip. The second luminescent conversion layer has a second luminescent conversion element located above the light emitting diode chip. An excitation efficiency of the first luminescent conversion element is higher than that of the second luminescent conversion element.

Light emitting diode package having multiple luminescent conversion layers

A light emitting diode package comprises a substrate with a first surface and a second surface opposite to each other, a circuit on the substrate, a support on the substrate for reinforcing strength of the substrate, a plurality of light emitting diodes on the substrate and electrically connected to the circuit, and a cover layer on the plurality of light emitting diodes. A method for manufacturing a light-emitting diode package is further provided.

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Hsinchu, Taiwan

Chieh-Ling Chang