Boe Technology Group Co., Ltd.

Mianyang Boe Optoelectronics Technology Co., Ltd.

Chieh Hsing Chung

Long Wang

Yanzhao Li

Jie Sun

Boris Kristal

Zhuo Chen

Li Zhou

Liye Duan

Feng Jiang

Chung-Chun Lee

Chung Chun Lee

A signal processing circuit and a driving method thereof, a display panel and a driving method thereof, and a display device are disclosed. The signal processing circuit includes a shunting circuit and N buffer circuits. The shunting circuit includes N output nodes, the N buffer circuits are respectively connected with the N output nodes. The shunting circuit is configured to output input signals to the N output nodes respectively at N different time points in response to control signals. Each of the N buffer circuits is configured to buffer and output the input signal received by a corresponding output node. N is an integer great than or equal to 2.

Signal processing circuit and driving method thereof, display panel and driving method thereof and display device

Provided are an OLED display substrate () and an OLED display device, in the field of display device. The OLED display substrate () includes a plurality of pixels, and each of the pixels includes two sub-pixels. The two sub-pixels include a first sub-pixel () and a second sub-pixel (). The first sub-pixel () includes a first light-emitting unit () and a second light-emitting unit () that are stacked; the second sub-pixel () includes a third light-emitting unit (); and the first light-emitting unit (), the second light-emitting unit () and the third light-emitting unit () are configured to emit lights with different colors. Under the same resolution, the aperture ratio of the OLED display substrate () may be increased. Alternatively, under the same size of sub-pixels, the resolution of the OLED display substrate () may be increased. Therefore, the brightness uniformity and display effect of the OLED display panel are improved.

OLED display substrate and OLED display device

A light-emitting diode (LED) substrate and a manufacturing method thereof, and a display device are provided. The LED substrate includes a receiving substrate, the receiving substrate is provided thereon with a pixel definition layer and a plurality of LED units, the pixel definition layer defines a plurality of sub-pixel regions, each of the plurality of sub-pixel regions is configured to receive at least one of the plurality of LED units, and a solder point and an auxiliary metal member are both provided in the sub-pixel region, the auxiliary metal member is provided at a periphery of the solder point, an interval is provided between the solder point and the auxiliary metal member in a plan view of the receiving substrate, and a melting point of the auxiliary metal member is higher than a melting point of the solder point.

Light-emitting diode substrate and manufacturing method thereof, and display device

An organic light-emitting diode (OLED) illuminating lamp sheet and a manufacturing method thereof are provided. The method for manufacturing an OLED illuminating lamp sheet includes: manufacturing an array substrate, the array substrate includes a first base and a first electrode formed on the first base; bonding an electrostatic film to a surface of the array substrate provided with the first electrode, forming a patterned electrostatic film by patterning the electrostatic film, and forming an organic film layer by taking the patterned electrostatic film as a mask; forming a second electrode and obtaining an OLED element; and encapsulating the OLED element and obtaining an OLED illuminating lamp sheet.

Organic light-emitting diode (OLED) illuminating lamp sheet and manufacturing method thereof

Embodiments of the present disclosure relate to a quantum dot light emitting diode subpixel array, a method for manufacturing the same, and a display device. The method for manufacturing the quantum dot light emitting diode subpixel array according to embodiments of the present disclosure comprises a quantum dot accepting layer forming step of forming a quantum dot accepting layer on a substrate; a thermosensitive quantum dot material layer applying step of applying a thermosensitive quantum dot material layer containing a thermosensitive organic ligand on the quantum dot accepting layer; and a thermosensitive quantum dot material transferring step of subjecting the organic ligand of the thermosensitive quantum dot material in a predetermined area of the thermosensitive quantum dot material layer to a chemical reaction by heating such that the thermosensitive quantum dot material in the predetermined area is transferred onto a corresponding subpixel region on the quantum dot accepting layer.

Quantum dot light emitting diode subpixel array, method for manufacturing the same, and display device

A light-emitting diode substrate and a manufacturing method thereof, and a display device are provided. The manufacturing method of a light-emitting diode (LED) substrate, including: disposing a supporting substrate supporting a plurality of LED units to be opposed to a receiving substrate so that a side of the supporting substrate facing the receiving substrate supports the plurality of LED units; and irradiating a side of the supporting substrate away from the receiving substrate with laser, stripping the LED units from the supporting substrate, and transferring the LED units onto the receiving substrate. The manufacturing method of the LED substrate can better transfer LED units from the supporting substrate onto the receiving substrate.

A pixel circuit is provided. The pixel circuit includes a photoelectric converter unit, an amplifier unit, a reset unit, a compensation unit, a charging unit, and a readout unit, wherein the photoelectric converter unit is connected to a first voltage terminal and the amplifier unit, and is configured to convert an optical signal into an electric signal, wherein the amplifier unit is connected to the photoelectric converter unit, the charging unit, and the readout unit, and is configured to amplify an output signal from the photoelectric converter unit, and wherein the reset unit is connected to a reset terminal, the first voltage terminal, and the amplifier unit, and is configured to reset the amplifier unit based on an input signal from the reset terminal and an input signal from the first voltage terminal.

Growing community of inventors

Beijing, China

Chieh Hsing Chung