Shin-etsu Chemical Co., Ltd.

Nippon Kayaku Kabushiki Kaisha

Chie Sasaki

Toshio Shiobara

Tsutomu Kashiwagi

Miyuki Wakao

Junichi Sawada

Yoshihiro Kawada

Naofusa Miyagawa

Naosuke Taniguchi

Masataka Nakanishi

Kenichi Kuboki

A silicone-modified epoxy resin composition that offers a cured product excellent in low permeability to gas, mechanical strength, and heat resistance and transparency and further offers an optical semiconductor sealing material excellent in heat cycle resistance, and a cured epoxy resin product obtained by curing the composition. The epoxy resin composition comprises the following components (A) to (C):

Epoxy resin containing silicone-modified epoxy resin and polyvalent carboxylic acid compound, and cured product thereof

A silicone-modified epoxy resin which yields a cured product having low gas permeability and excellent strength; a composition of the silicone-modified epoxy resin; and an epoxy resin cured product obtainable by curing the composition, are provided. An epoxy resin represented by the following Formula (1): 

Silicone-modified epoxy resin, composition containing the epoxy resin, and cured product of same

The purpose of the present invention is to provide a silicone-modified epoxy resin which produces a cured product having excellent low gas permeability and strength; a composition of the resin; and an epoxy resin cured product obtainable by curing the composition. Disclosed is an epoxy resin represented by the following Formula (1): 

Silicone-modified epoxy resin, composition containing said epoxy resin, and cured product thereof

An epoxy resin represented by the following formula (1)  wherein Rrepresents an alkylene group having 2 to 6 carbon atoms and optionally containing an ester or ether bond; Rrepresents a monovalent aliphatic hydrocarbon group having 1 to 6 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; Rrepresents an oxygen atom or a phenylene group; k represents 1 to 10 as an average value; m represents an integer of 0 to 2; n represents 0 to 10 as an average value; and a plurality of groups R, R, R, k, or m present in the formula may be the same or different from each other.

Silicone-modified epoxy resin and composition and cured article thereof

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Tokyo, Japan

Chie Sasaki