Konica Minolta, Inc.

Other

Tabata, Yasuhiko

Chie Inui

Atsushi Takahashi

Akihiro Maezawa

Yuuki Nagai

Natsumi Hirayama

Yasuhiko Tabata

Makoto Mochizuki

Hideaki Wakamatsu

Natsuki Ito

Keisuke Mizoguchi

Disclosed herein are gelatin particles including gelatin, wherein when a major-axis length of dried gelatin particles is defined as a and a major-axis length of gelatin particles after swelling treatment obtained by immersing the dried gelatin particles in water at 40° C. under an atmospheric pressure for 60 minutes is defined as b, swelling degree represented by b/a is 1.0 or more but 10.0 or less, and wherein the gelatin particles after swelling treatment have a particle diameter of 1.0 nm or more but 5.0 μm or less. The gelatin particles are easily taken up by cells themselves.

Gelatin particles, method for producing gelatin particles, gelatin particle-containing cell, and method for producing gelatin particle-containing cell

The present invention addresses the problem of providing: a hydrogel particle which can be taken into a cell by the action of the cell and can control the release of a magnetic particle enclosed therein into the cell so as to retain the magnetic particle in the cell for a long period; a method for producing the hydrogel particle; a cell or a cell structure each enclosing the hydrogel particle therein; and a method for evaluating the activity of a cell using the hydrogel particle. The present invention solves the problem by a hydrogel particle including: a domain which is composed of a first hydrogel; a matrix which encloses the domain and is composed of a second hydrogel having a different crosslinking degree or composition from that of the first hydrogel; and a magnetic particle which is supported by at least the first hydrogel.

Hydrogel particle and method for producing same, cell or cell structure each enclosing hydrogel particle therein, method for evaluating activity of cell using hydrogel particle, and use of hydrogel particle as sustained release preparation

An object of the present invention is to provide an abrasive slurry regeneration method capable of efficiently regenerating an abrasive slurry having a high polishing rate. The abrasive slurry regeneration method is an abrasive slurry regeneration method for polishing a polishing target containing silicon oxide as a main component using an abrasive slurry containing abrasive particles and a plurality of kinds of additives and then regenerating a collected abrasive slurry, characterized by including a regeneration step of collecting an additive having a molecular weight of 500 or more and an additive adsorbed by the abrasive particles among additives contained in the collected abrasive slurry together with the abrasive particles while an abrasive concentration (% by mass) is maintained within a range of 0.2 to 3000% with respect to an abrasive concentration (% by mass) of an unused abrasive slurry when being used for polishing a polishing target.

Abrasive slurry regeneration method

A method for collecting an abrasive from an abrasive slurry which has been used for polishing an object including silicon as a main component includes: (i) adding a solvent to the abrasive slurry; (ii) dissolving particles of the polished object among components of the polished object contained in the abrasive slurry; and (iii) filtering the abrasive slurry to collect the abrasive, in which the steps (i) to (iii) are carried out without a pH adjuster to remove components of the polished object to collect the abrasive.

Recovery method for abrasive

A method for preparing a recycled abrasive slurry includes: polishing a material to be polished, which includes silicon as a main component, with an abrasive slurry including a plurality of kinds of additives added for different purposes; and preparing a recycled abrasive slurry from a collected abrasive slurry collected after the polishing, wherein the recycled abrasive slurry is prepared through: step 1 of removing, from the collected abrasive slurry, at least an additive B capable of decreasing a polishing rate among the plurality of additives, and step 2 of replenishing at least an additive A capable of increasing a polishing rate among the plurality of additives, to the abrasive slurry from which an additive has been removed, which has been prepared in step 1.

Method for preparing recycled abrasive slurry

A diamond abrasive recovery method in which diamond abrasive is recovered from polishing material slurry including diamond abrasive used for polishing a polishing target mainly composed of silicon. The method comprises (1) recovering polishing material slurry including the used diamond abrasive; (2) adding inorganic salt including a metallic element which is to be a divalent or trivalent cation to the recovered polishing material slurry to aggregate the diamond abrasive and separating a supernatant liquid from a diamond abrasive included dispersion medium; and (3) extracting diamond abrasive from the separated diamond abrasive included dispersion medium using a low polarity dispersion medium.

Diamond abrasive recovery method

Disclosed are polishing material particles which have polishing performance suitable for precision polishing and also have a high polishing speed and high monodispersibility; a polishing material containing the polishing material particles; and a polishing processing method using the polishing material. The polishing material particles are spherical particles having an average aspect ratio of 1.00 to 1.15, wherein the particle diameter (D(nm)) of the polishing material particles as determined from a particle diameter cumulative distribution curve falls within the range from 50 to 1500 nm. The average content of cerium or the total content of cerium and at least one element selected from lanthanum (La), praseodymium (Pr), neodymium (Nd), samarium (Sm) and europium (Eu) in the polishing material particles is 81 mol % or more relative to the total content of all of rare earth elements that constitute the polishing material particles.

Growing community of inventors

Hino, Japan

Chie Inui