Ganrich Semiconductor Corporation

Epistar Corporation

Chiao Fu

Chen-Yu Wang

Sheng-Bo Wang

Yao-Zhong Liu

Jia-Tay Kuo

Jai-Tai Kuo

Chang-Hsieh Wu

Chao-Kai Chang

Yi-Ru Shen

A package structure is provided herein, which includes a substrate, an integrated transistor, and an encapsulation structure. The integrated transistor is disposed on the substrate and includes a transistor, a capacitor, a resistor, a first Zener diode, and a second Zener diode. The transistor includes a gate, a drain, and a source. The capacitor is electrically connected to the gate, and the resistor is electrically connected to the gate. The first Zener diode includes a first anode and a first cathode electrically connected to the gate. The second Zener diode includes a second anode electrically connected to the first anode and a second cathode electrically connected to the source. The encapsulation structure encapsulates the integrated transistor. The package structure includes a gate terminal, a drain terminal, and a source terminal.

Package structure

Package structure for a semiconductor element

A voltage converter circuit, comprising: a bridge rectifier; a first transistor, having a first end, a second end and a third end; a second transistor, having a first end and a second end; wherein the first end of the first transistor and the first end of second transistor are electrically connected to bridge rectifier, and the second end of the first transistor is electrically connected to the first end of the second transistor; and a Zener diode, connected between the third end of the first transistor and the second end of the second transistor.

Voltage converter circuit for converting AC voltage to DC voltage

Growing community of inventors

Hsinchu, Taiwan

Chiao Fu