Taiwan Semiconductor Manufacturing Comp. Ltd.

Chiang Fu

Yu-Chyi Harn

Chien-Chen Chen

Jun-Yen Huang

Ming Chu King

The present invention provides a method for cleaning wafer surfaces in a scrubber by ion doped deionized water without the electrostatic discharge problem. The method can be carried out by first doping a quantity of deionized water with at least one species of ions from the group consisting of OH , F , Cl , NH and H any other suitable ions. The added ions significantly reduce the resistivity of the DI water such that DI water is no longer a perfect insulator and therefore, when sprayed onto wafer surfaces covered by an insulating material, the generation of electrostatic charges is significantly reduced. As a result, the undesirable effect of electrostatic discharge can be significantly reduced or eliminated and the yield of the wafer fabrication process can be improved.

Method for cleaning wafers with ionized water

A method preventing the arcing effect during contact implantation by employing a conductive shielding film within the contact opening in the fabrication of an integrated circuit is described. A dielectric layer is provided overlying a semiconductor substrate of a wafer. The dielectric layer is etched into to provide a contact opening through the dielectric layer to the semiconductor substrate. A conducting layer is deposited overlying the dielectric layer and within the contact opening. A photoresist mask is formed over the conducting layer having an opening above the contact opening. The wafer is placed in an ion implantation chamber wherein the wafer is held by means of an electrostatic chuck. Ions are implanted into the semiconductor substrate through the conducting layer not covered by the photoresist mask wherein some of the ions are trapped on photoresist mask and wherein the conducting layer conducts the trapped ions throughout the wafer thereby preventing charge damage to the dielectric layer.

Growing community of inventors

Hsin-Chu, Taiwan

Chiang Fu