Teledyne Scientific and Imaging, LLC

Teledyne Licensing, LLC

Integrated Sensing Systems, Inc.

Other

The Boeing Company

Rockwell Scientific Licensing LLC

Innovative Technology Licensing LLC

Chialun Tsai

Jeffrey DeNatale

Philip Stupar

Robert L Borwick, Iii

Chung-Lung Chen

Nader Najafi

Srinivas Tadigadapa

Steve Qingjun Cai

Yafan Zhang

Jian Jim Ma

Graham J Martin

Qingjun Cai

Ya-Chi Chen

Alan L Sailer

Jeffrey F DaNatale

A system and method is disclosed for fabricating a heat spreader system, including providing a plurality of bottom microporous wicks recessed in a bottom substrate, bonding a center substrate to the bottom substrate, and bonding a top substrate having a top chamber portion to the center substrate to establish a first vapor chamber with said plurality of bottom microporous wicks.

Heat spreader with high heat flux and high thermal conductivity

A wafer-level manufacturing method produces stress compensated x-y gimbaled comb-driven MEMS mirror arrays using two SOI wafers and a single carrier wafer. MEMS structures such as comb drives, springs, and optical surfaces are formed by processing front substrate layer surfaces of the SOI wafers, bonding together the processed surfaces, and removing the unprocessed SOI layers to expose second surfaces of the front substrate layers for further wafer-level processing. The bonded SOI wafers are mounted to a surface of the carrier wafer that has been separately processed. Processing wafer surfaces may include formation of a stress compensation layer to counteract physical effects of MEMS mirrors. The method may form multi-layered conductive spring structures for the mirrors, each spring having a first conducting layer for energizing a comb drive, a second conducting layer imparting a restoring force, and an insulating layer between the first and second conducting layers.

Manufacturing method for stress compensated X-Y gimbaled MEMS mirror array

A vapor cell includes an interrogation cell in a substrate, the interrogation cell having an entrance window and an exit window, and a first transparent thin-film heater in thermal communication with the entrance window. The transparent thin-film heater has a first layer in communication with a first pole contact at a proximal end of the heater and a layer coupler contact at a distal end, a second layer in communication with a second pole contact at the proximal end, and the second layer electrically coupled to the layer coupler contact at the distal end. An insulating layer is sandwiched between the first and second layers. The insulating layer has an opening at the distal end to admit the layer coupler contact and to insulate the remainder of the second layer from the first layer. The first and second pole contacts are available to complete an electric circuit at the proximal end, with magnetic fields for each of the first and second layers oriented in opposing directions when a current is applied through the circuit.

System for heating a vapor cell

A system is disclosed for charging a compact vapor cell, including placing an alkali-filled capillary into a reservoir cell formed in a substrate, the reservoir cell in vapor communication with an interrogation cell in the substrate and bonding a transparent window to the substrate on a common face of the reservoir cell and the interrogation cell to form a compact vapor cell. Capillary action in the capillary delays migration of alkali in the alkali-filled capillary from the reservoir cell into the interrogation cell during the bonding.

System for charging a vapor cell

A wafer-level manufacturing method produces stress compensated x-y gimbaled comb-driven MEMS mirror arrays using two SOI wafers and a single carrier wafer. MEMS structures such as comb drives, springs, and optical surfaces are formed by processing front substrate layer surfaces of the SOI wafers, bonding together the processed surfaces, and removing the unprocessed SOI layers to expose second surfaces of the front substrate layers for further wafer-level processing. The bonded SOI wafers are mounted to a surface of the carrier wafer that has been separately processed. Processing wafer surfaces may include formation of a stress compensation layer to counteract physical effects of MEMS mirrors to be formed in a subsequent step. The method may form multi-layered conductive spring structures for the mirrors, each spring having a first conducting layer for energizing a comb drive, a second conducting layer imparting a restoring force, and an insulating layer between the first and second conducting layers.

Provided is a chip-scale atomic clock having a folded optic configuration or physics package. In particular, the physics package includes a vapor cell for containing gaseous alkali atoms and a VCSEL for generating a laser light One or more heating elements are positioned to simultaneously heat both the vapor cell and VCSEL to the required operating temperature. A micro-lens element, positioned between the VCSEL and a reflector, is used to first expand the beam of light, and then to subsequently collimate the light after it is once reflected. Collimated, reflected light passes through the vapor cell wherein the alkali atoms are excited and a percentage of the reflected light is absorbed. A detector, located opposite the reflector and micro-lens array, detects light passing through the cell. An error signal is generated and the output voltage of a local voltage oscillator is successively stabilized.

Compact optical assembly for chip-scale atomic clock

An optical cross-connect is provided. The optical cross-connect includes a glass wedge, having a front end and a back end, positioned between a first one-dimensional collimator array and a second one-dimensional collimator array, where the first collimator array includes a first V-groove array having a first set of etched grooves for placing a first group of optical fibers and the second collimator array includes a second V-groove array having a second set of etched grooves for placing a second group of optical fibers; and a MEMS substrate attached at a fixed distance to the front end of the glass wedge, where the front end is covered in a reflective coating for reflecting light from the first and second collimator arrays onto the MEMS substrate.

Optical cross-connect

A micromirror apparatus includes a device layer having a recess, a multilayer thin-film dielectric reflector coupled to and structurally supported by the device layer on the opposite side of the device layer from said recess, and a stress compensator seated in the recess, with the stress compensator operable to resist device layer bending moments resulting from intrinsic and thermal mismatch stresses between the multilayer thin-film dielectric reflector and the device layer.

Thermal and intrinsic stress compensated micromirror apparatus and method

Micromachine fluidic apparatus incorporates a free-standing tube section and electrodes to actuate or control the movement of the tube section, or to sense the movement of the tube section, or both. Electronic circuitry, which may be disposed on the same substrate as the fluidic portion of the apparatus, is used in conjunction with the tube and electrodes in conjunction with a variety of different applications, including fluid flow measurement, fluid density measurement, fluid viscosity measurement, fluid transport, separation and/or mixing. According to a particular embodiment, the free-standing section of the tube is resonated for fluid flow and density measurements according to the Coriolis effect. Capacitive/electrostatic actuation techniques are used to control or resonate the free-standing section of the tube, and to detect variations in tube movement. Different methods of fabricating micromachine fluidic apparatus are also disclosed, including the use of fusion bonding of non-conducting substrates, high-aspect ratio etching techniques, and anisotropic etching and refill techniques, preferably utilizing chevron-shaped slit openings to fabricate microtube sections.

Method of fabricating a micromachined tube for fluid flow

A MEMS fabrication process eliminates through-wafer etching, minimizes the thickness of silicon device layers and the required etch times, provides exceptionally precise layer to layer alignment, does not require a wet etch to release the moveable device structure, employs a supporting substrate having no device features on one side, and utilizes low-temperature metal-metal bonding which is relatively insensitive to environmental particulates. This process provided almost 100% yield of scanning micromirror devices exhibiting scanning over a 12&#xb0; optical range and a mechanical angle of3&#xb0; at a high resonant frequency of 2.5 kHz with an operating voltage of only 20 VDC.

Process for high yield fabrication of MEMS devices

An apparatus for authenticating an object on the basis of incorporating onto the object at least one security feature known as a microdot which includes plural unique microscopic patterned markers each of which include indicia and the method of making such microdots.

Method and apparatus of using a security feature which includes plural patterned microscopic makers for authentication and to prevent counterfeiting of objects

A MEMS device with a electrostatic comb actuator is comprised of a supporting substrate, with device features on only one side, and two silicon device layers locally bonded together by thermal compression bonding of metal pads. Use of a supporting substrate enables the silicon device layers to be relatively thin and eliminates the through-wafer etch procedure, which greatly reduces silicon etch times and improves the accuracy and yield of the etch processes. Use of metal-metal interlayer bonds avoids the need for a wet chemical etch for release of the moveable structure so that the device can be fabricated with high yield. Scanning micromirror devices according to the present invention were fabricated with almost 100% yield and exhibited scanning over a 12&deg; optical range and a mechanical angle of 3&deg; at a high resonant frequency of 2.5 kHz with an operating voltage of only 20 VDC.

Growing community of inventors

Thousand Oaks, CA, United States of America

Chialun Tsai