Hitachi Chemical Company, Ltd.

Hitachi, Ltd.

Chiaki Yamagishi

Masato Fukasawa

Naoyuki Koyama

Kazuhiro Enomoto

Yasushi Kurata

Masato Yoshida

Kouji Haga

Yuto Ootsuki

Yutaka Ito

Masatoshi Wakagi

Shigeru Hayashida

Takayuki Nakakawaji

Masanobu Hanazono

Kunihiro Tamahashi

Shigeki Komatsuzaki

Mitsuyoshi Shoji

Hidetaka Sato

Fuminori Ishikawa

Masato Taya

Shigeharu Onuma

Shigeo Nara

Nori Sasaki

Yasuo Shimamura

The present invention provides a CMP abrasive slurry for polishing insulation film, that allow efficiently and high-speed polishing of insulation films such as SiOfilm and SiOC film in the CMP method of flattening an interlayer insulation film, a BPSG film, an insulation film for shallow trench isolation, or a wiring-insulating film layer, a polishing method by using the abrasive slurry, and a semiconductor electronic part polished by the polishing method. A CMP abrasive slurry for polishing insulation film containing cerium oxide particles, a dispersant, a water-soluble polymer having amino groups on the side chains and water, a polishing method by using the CMP abrasive slurry, and a semiconductor electronic part polished by the polishing method.

CMP abrasive slurry for polishing insulation film, polishing method, and semiconductor electronic part polished by the polishing method

The present invention relates to a CMP polishing slurry, comprising cerium oxide particles, a dispersing agent, a water-soluble polymer and water, wherein the water-soluble polymer is a compound having a skeleton of any one of an N-mono-substituted product and an N,N-di-substituted product of any one selected from the group consisting of acrylamide, methacrylamide and &#x3b1;-substituted products thereof. The amount of the water-soluble polymer is preferably in the range of 0.01 part or more by weight and 10 parts or less by weight for 100 parts by weight of the polishing slurry. Thus it is possible to provide a polishing slurry and a polishing method which make it possible to polish a film made of silicon oxide or the like effectively and rapidly and further control the process therefore easily in CMP technique for flattening an interlayer insulating film, a BPSG film, an insulator film for shallow trench isolation, and other films.

CMP polishing slurry and polishing method

The present invention relates to a CMP polishing slurry, comprising cerium oxide particles, a dispersing agent, a water-soluble polymer and water, wherein the water-soluble polymer is a compound having a skeleton of any one of an N-mono-substituted product and an N,N-di-substituted product of any one selected from the group consisting of acrylamide, methacrylamide and &#x3b1;-substituted products thereof. The amount of the water-soluble polymer is preferably in the range of 0.01 part or more by weight and 10 parts or less by weight for 100 parts by weight of the polishing slurry. Thus it is possible to provide a polishing slurry and a polishing method which make it possible to polish a film made of silicon oxide or the like effectively and rapidly and further control the process therefor easily in CMP technique for flattening an interlayer insulating film, a BPSG film, an insulator film for shallow trench isolation, and other films.

CMP polishing compound and polishing method

Polyimides satisfying the requirements (a), (b) and (c) among the requirements described below, polyimides satisfying the requirements (b), (c) and (d), and polyimides satisfying the requirements (a), (b), (c) and (d) are excellent in transparency, isotropy and resistance to cracking (no crack is formed in the formation of a multilayer film, so that the multilayer formation is easy, namely, the polyimides are good in processability) and can give optical parts excellent in optical characteristics:

Polyimides and optical parts obtained by using the same

An electrophotographic member comprising a support, a photoconductive layer formed thereon, and a surface layer formed thereon, said surface layer including or attaching a lubricating agent having a perfluoropolyoxyalkyl or perfluoropolyoxyalkylene group to form an organic surface protective lubricating layer, and a fixing group to be fixed to the surface layer, is excellent in moisture resistance, wear resistance and cleaning properties and thus useful in an electrophotographic apparatus with a long life and high reliability.

Electrophotographic member containing a fluorine-containing lubricating

Growing community of inventors

Hitachi, Japan

Chiaki Yamagishi