Teijin Limited

Shibaura Machine Co., Ltd.

Fuji Seiki Machine Works, Ltd.

Toshiba Machine Co., Ltd.

Chiaki Shigematsu

Tetsuya Yoneda

Akihiko Obata

Hodaka Yokomizo

Kazuhito Sato

Naokatsu Kojima

A conveyance device includes a plurality of holding mechanisms and one or more pressing mechanisms, the holding mechanisms each include a holder that holds a molding material and a holder movement mechanism that moves the holder, and the pressing mechanisms each include a pusher that comes into contact with and pushes the molding material and a pusher movement mechanism that moves the pusher.

Conveyance device and conveyance head

To provide a method of manufacturing a press molding by molding a molding material comprising reinforced fibers and a thermoplastic resin by a cold press method. The method of manufacturing a press molding comprising reinforced fibers and a thermoplastic resin, includes the steps of:

Method of manufacturing a press molding

A solder coating apparatus for coating lead sections of a lead frame, including a liquid solder bath and a coating block having a first slit-like passage therethrough for permitting a lead frame to pass through the block and a second passage of enlarged cross section communicating with and extending along the first passage for permitting the lead frame package to pass through the block. A pair of liquid solder supply slits are formed in the block and communicates with the first passage along the length thereof and on opposite sides of the second passage. A pump at least partially immersed in the liquid solder bath provides for positive supply of liquid solder to and through the slits into the first passage to coat the lead sections. A conduit connects between the delivery side of the pump and the liquid solder supply slits.

Solder coating apparatus

Growing community of inventors

Shizuoka, Japan

Chiaki Shigematsu