Hitachi Chemical Company, Ltd.

Chiaki Okada

Masato Fukasawa

Takashi Ikeda

Osamu Higashida

Hatuo Sugitani

Yuugo Kumagai

Tetsuya Fujii

Yukari Inoue

Ryouji Tan

Kazuhiko Yamada

The present invention relates to a resin paste composition including an organic compound, and a granular aluminum powder having an average particle diameter of from 2 to 10 &#x3bc;m and a flake-shaped silver powder having an average particle diameter of from 1 to 5 &#x3bc;m which are uniformly dispersed in the organic compound, and a semiconductor device manufactured by bonding a semiconductor element onto a supporting member through the resin paste composition and then encapsulating the resulting bonded product. According to the present invention, it is possible to provide a resin paste composition used for bonding an element such as semiconductor chips onto a lead frame which is excellent in not only electrical conductivity and bonding property but also working efficiency without using a large amount of rare and expensive silver, and a semiconductor device having a high productivity and a high reliability.

Resin paste composition

A dry toner composition comprising (A) a binder resin, (B) a colorant and (C) charge control agents comprising a special metal complex of oxycarboxylic acid (C-1) and a special metal complex of azo compound (C-2) can provide high quality images without causing toner flying even after printed for a long period of time, and thus is useful for providing a dry developer and a process for forming images using said dry developer.

Dry toner, dry developer and process for forming electrophotographic

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Ibaraki, Japan

Chiaki Okada