Everlight Electronics Co., Ltd.

Chia-Yun Hsu

Chih-Hung Hsu

Ying-Jhong Chen

A light-emitting device package structure includes a leadframe, a light-emitting device disposed on the leadframe, a plurality of wires electrically connecting the leadframe and the light-emitting device, and an encapsulant covering the light-emitting device, the wires and a part of the leadframe. The encapsulant has a gas space therein, and the gas space is disposed on the light-emitting device, wherein the gas space includes at least one gas.

Light-emitting device package structure

A light-emitting diode structure is provided. The light-emitting diode structure includes a light-emitting diode chip, a lead frame for electrically connecting and supporting the light-emitting diode chip, and a lens covering the light-emitting diode chip and to partially cover the lead frame. A recess disposed on the upper portion of the lens has a ladder-like inner wall formed of an upper inclined wall portion, a lower inclined wall portion, and a connecting wall portion connected to the upper and lower inclined wall portions. The slope of the upper inclined wall portion is greater than that of the lower inclined wall portion, and the slope of the connecting wall portion is greater than the upper and lower inclined wall portions.

Light-emitting diode structure

An illumination module includes a substrate and a plurality of LED devices. The substrate has a main plane, and the main plane includes a central region and a peripheral region. The LED devices are disposed on the main plane of the substrate in the central region and peripheral region. Each of the LED devices has a light-exiting direction, where the light-exiting direction of the LED device disposed in the central region is substantially perpendicular to the main plane, and the light-exiting direction of each of the LED devices in the peripheral region goes outwards with respect to the central region.

Growing community of inventors

Taipei Hsien, Taiwan

Chia-Yun Hsu