Taiwan Semiconductor Manufacturing Comp. Ltd.

Ambit Microsystems Corporation

Chia-Yuan Chen

Po-Tao Chu

Hung-Jen Lu

Ming-Hsien Lee

Cheng-Chia Hsu

Wei-Hong Lin

Deng-Kang Chang

The present disclosure, in some embodiments, relates to a method of transporting a semiconductor wafer. The method includes transferring a semiconductor wafer into a first wafer slot of a second plurality of wafer slots within an adaptive inset. The adaptive inset is arranged within an interior cavity of a wafer cassette having a first plurality of wafer slots while transferring the semiconductor wafer into the first wafer slot. The wafer cassette and the adaptive inset are transported into a loading port of a semiconductor processing tool configured to perform a fabrication process on the semiconductor wafer.

Adaptive inset for wafer cassette system

The present disclosure, in some embodiments, relates to a wafer cassette system. The wafer cassette system includes a wafer cassette includes a first plurality of wafer slots respectively having a first width. An adaptive inset is fastened to the wafer cassette in a rigid connection. The adaptive inset includes a second plurality of wafer slots respectively having a second width that is less than the first width. The second plurality of wafer slots are configured to receive a substrate after the adaptive inset has been fastened to the wafer cassette.

The present disclosure relates to a wafer cassette system having an adaptive inset configured to enable wafers having a first diameter to be held by a wafer cassette configured to hold wafers having a second diameter larger than the first diameter. The wafer cassette system includes a wafer cassette having a first plurality of wafer slots configured to receive one or more wafers having a first diameter. An adaptive inset is arranged in an interior cavity of the wafer cassette. The adaptive inset has a second plurality of wafer slots configured to receive one or more wafers having a second diameter that is less than the first diameter. The adaptive inset allows for the wafer cassette to hold wafers having the second diameter, thereby enabling semiconductor processing tools to processes wafer having a different diameter than those able to be held by wafer cassettes that the tools can receive.

A multi-lamp system for driving a lamp set having a first lamp and a second lamp comprises a driving circuit for converting a DC signal to an AC signal, a transformer having a primary side coupled to the driving circuit and a secondary side for outputting the AC power, and a current balance circuit coupled to the low voltage terminal of the lamp set for balancing the current values flowing through the first lamp and the second lamp. The current balance circuit comprises a magnetic core, a first winding coupled to the first lamp and a second winding coupled to the second lamp. The first winding and the second winding are wound on the magnetic core and have the same coil number.

Multi-lamp driving system

A system for driving a plurality of lamps is disclosed to balance currents flowing through the lamps by means of impedance matching. According to the multi-lamp driving system of the present invention, a balancing controller is employed to match the impedance of each lamp path so as to regulate currents flowing through the lamps to be substantially the same.

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Hsinchu, Taiwan

Chia-Yuan Chen