Taiwan Semiconductor Manufacturing Comp. Ltd.

Quanta Computer Incorporated

Institute of Nuclear Energy Research, Atomic Energy Council, Executive Yuan, R.o.c

Chia-Yu Lin

Jui-Chun Weng

Hsi-Cheng Hsu

Chia-Chun Hung

Ji-Hong Chiang

Ching-Hsiang Hu

Kuo-Hao Lee

Yu-Pei Chiang

Lavanya Sanagavarapu

Jia-Syuan Li

Chien-Tai Su

Yen-Chieh Tu

Hsin-Yu Chen

Hsin-yu Chen

Fan-Pin Tseng

I-Chung Chen

Zhen-An Hung

Shin-Hong Chen

Zhi-Xian Yang

Alignment of devices formed on substrates that are to be bonded may be achieved through the use of scribe lines between the devices, where the scribe lines progressively increase or decrease in size from a center to an edge of one or more of the substrates to compensate for differences in the thermal expansion rates of the substrates. The devices on the substrates are brought into alignment as the substrates are heated during a bonding operation due to the progressively increased or decreased sizes of the scribe lines. The scribe lines may be arranged in a single direction in a substrate to compensate for thermal expansion along a single axis of the substrate or may be arranged in a plurality of directions to compensate for actinomorphic thermal expansion.

Wafer bonding alignment

A method for updating software comprises transmitting a first version of the software and a first decryption key to a computing system. The method further comprises generating a second version of the software and a second decryption key. The method further comprises encrypting the second version of the software and the second decryption key. The encrypted second version of the software is configured to be decrypted using the first decryption key and not the second decryption key. The method further comprises transmitting the encrypted second version of the software and the encrypted second decryption key to the computing system.

Methods for securely updating software

A micro-electromechanical-system (MEMS) device may be formed to include an anti-stiction polysilicon layer on one or more moveable MEMS structures of a device wafer of the MEMS device to reduce, minimize, and/or eliminate stiction between the moveable MEMS structures and other components or structures of the MEMS device. The anti-stiction polysilicon layer may be formed such that a surface roughness of the anti-stiction polysilicon layer is greater than the surface roughness of a bonding polysilicon layer on the surfaces of the device wafer that are to be bonded to a circuitry wafer of the MEMS device. The higher surface roughness of the anti-stiction polysilicon layer may reduce the surface area of the bottom of the moveable MEMS structures, which may reduce the likelihood that the one or more moveable MEMS structures will become stuck to the other components or structures.

Roughness selectivity for MEMS movement stiction reduction

A system and method for monitoring and recovering a heterogeneous integrated circuit, such as an FPGA, operating with firmware. A firmware image for the integrated circuit is stored in a storage device. The operational status of the integrated circuit is periodically determined via a controller such as a BMC. A failure of the integrated circuit is determined. The stored firmware image is sent to the integrated circuit. The firmware image is installed on the integrated circuit. The controller determines whether the installation of the firmware image results in restoration of the integrated circuit.

Method and system for recovery for custom integrated circuit

A reduction method for a boundary artifact on the tomosynthesis includes steps of performing a projection process, performing a back projection process upon the geometric factor matrix so as to obtain a back-projection geometric factor matrix, and adjusting a boundary area of the back-projection geometric factor matrix.

Reduction method for boundary artifact on the tomosynthesis

Growing community of inventors

Taoyuan, Taiwan

Chia-Yu Lin