Texas Instruments Corporation

Mega 1 Company Limited

Chia-Yu Chang

Steven Su

Chih-Chien Ho

Yuh-Harng Chien

Wen-Chieh Wu

Makoto Masuda

Bob Lee

Fu-Kang Lee

Chih-Yu Yang

Chih-Han Yen

Chung-Ming Cheng

Chang-Wei Huang

A projecting apparatus is provided, and includes a frame, a light source module, and a microelectromechanical systems (MEMS) module. The frame includes two lateral boards respectively arranged on two opposite sides thereof, and a transverse beam that connects the two lateral boards. Each of the two lateral boards has a guiding slot recessed in a portion thereof. The MEMS module is configured to transmit light emitted from the light source module, and includes a flexible circuit board, a first MEMS unit, and a second MEMS unit, the latter two of which are connected to the flexible circuit board. The first MEMS unit is inserted into the guiding slots of the two lateral boards. The second MEMS unit abuts against the two lateral boards and/or the transverse beam. The first MEMS unit and the second MEMS unit have a predetermined angle there-between by the second frame portion.

Projecting apparatus

A leadframe includes a first die attach pad ('DAP') having a first longitudinally extending edge surface and a second DAP having a first longitudinally extending edge surface. The second DAP is positioned with the first longitudinally extending edge surface thereof in adjacent, laterally and vertically spaced relationship with the first longitudinally extending edge surface of the first DAP.

Leadframe with vertically spaced die attach pads

A leadframe comprising a plurality of leads, each of the plurality of leads having a proximal end and a distal end opposite the proximal end, the distal ends positioned along a linear axis. The leadframe further comprises a die pad closer to the proximal ends than the distal ends of the plurality of leads and including an edge positioned along a plane that intersects the linear axis at an angle less than 90 degrees.

Angled die pad of a leadframe for a molded integrated circuit package

A leadframe () comprises a frame () of sheet metal in a first planar level, where the frame has metallic leads () and a first metallic pad () extending inward from the frame, and the first pad is tied to the frame by first metallic straps (). The leadframe further has a second metallic pad () in a second planar level parallel to and spaced from the first level, where the second pad is tied by second metallic straps () to the frame. In addition, the leadframe has a third metallic pad () in a third planar level parallel to and spaced from the second level and additively from the first level, where the third pad is tied by third metallic straps () to the second pad.

Packaged semiconductor device having multi-level leadframes configured as modules

Semiconductor package having a leadframe with multi-level assembly pads

A leadframe for encasing in a mold material includes a plurality of interconnected support members. A die pad is connected to the support members and includes a bottom surface. The die pad is configured to receive a die. A downset is connected to the die pad and positioned below the bottom surface. The downset includes at least one wall defining an interior volume for receiving a flow of the mold material to reduce the velocity of the mold material flow through the downset.

Planar leadframe substrate having a downset below within a die area

Growing community of inventors

Taipei Hsien, Taiwan

Chia-Yu Chang