Powertech Technology Inc.

Chia-Wei Chiang

Li-Chih Fang

Wen-Jeng Fan

Chun-Te Lin

Ji-Cheng Lin

Che-Min Chu

Chien-Wen Huang

A package structure including a die, a plurality of first conductive connectors, a second conductive connector electrically insulated from the die, a redistribution layer and a conductive shield is provided. The die includes an active surface, a back surface opposite the active surface, and a sidewall coupling the active surface to the back surface. The first conductive connectors are disposed on the active surface of the die and electrically connected to the die. The second conductive connector is disposed on the die and aside the first conductive connectors. The redistribution layer is disposed on the die and electrically connected to the first conductive connectors and the second conductive connector. The conductive shield coupled to the redistribution layer surrounds the second conductive connector and at least a portion of the sidewall. The die is electrically insulated to the conductive shield. A chip package structure is also provided.

Package structure and chip structure

A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a conductive casing, a semiconductor die, a conductive connector, an insulating encapsulant, a redistribution structure, and a first conductive terminal. The conductive casing has a cavity. The semiconductor die is disposed in the cavity of the conductive casing. The conductive connector is disposed on a periphery of the conductive casing. The insulating encapsulant encapsulates the conductive connector, the semiconductor die and the cavity. The redistribution structure is formed on the insulating encapsulant and is electrically connected to the conductive connector and the semiconductor die. The first conductive terminal is disposed in openings of the redistribution structure and is physically in contact with a portion of the conductive casing.

Semiconductor package with a conductive casing for heat dissipation and  electromagnetic interference (EMI) shield and manufacturing method thereof

A semiconductor package including a stacked-die structure, a second encapsulant laterally encapsulating the stacked-die structure and a redistribution layer disposed on the second encapsulant and the staked-die structure is provided. The stacked-die structure includes a first semiconductor die including a first active surface, a circuit layer disposed on the first active surface, a second semiconductor die including a second active surface facing towards the first active surface, a plurality of conductive features distributed at the circuit layer and electrically connected to the first and second semiconductor die and a first encapsulant encapsulating the second semiconductor die and the conductive features. A portion of the conductive features surrounds the second semiconductor die. The redistribution layer is electrically connected to the staked-die structure. A manufacturing method of a semiconductor package is also provided.

Semiconductor package and manufacturing method thereof

A manufacturing method of a package structure including the following steps is provided. A plurality of first conductive connectors and a second conductive connector on an active surface of a die are formed. The first conductive connectors are electrically connected to the die. The second conductive connector is formed aside the first conductive connectors and electrically insulated to the die. A redistribution layer is formed on the die. The redistribution layer is electrically connected to the first conductive connectors and the second conductive connector. A conductive shield is formed on the redistribution layer to surround the second conductive connector and at least a portion of a sidewall of the die coupled the active surface. The die is electrically insulated from the conductive shield. Another manufacturing method of a package structure is also provided.

Growing community of inventors

Hsinchu County, Taiwan

Chia-Wei Chiang