Triple Win Technology(shenzhen) Co.ltd.

Super Micro Computer, Inc.

Gudeng Precision Industrial Co., Ltd.

Rotatech International Corp.

Chia-Wei Chen

Shin-Wen Chen

Yueh-Ming Liu

Kun-Chieh Liao

Jing-Wei Li

Sheng-Jie Ding

Ye-Quang Chen

Ming-Chien Chiu

Yu-Chuan Chang

Ding-Nan Huang

Shao-Syuan Syu

Chia-Che Chang

Hsiao-Chung Chen

Yu-Hsiang Huang

Hua-Kai Tong

Tan-Hsin Chang

Yu-Yen Hsiung

Ming-Yu Chen

Zheng-Hong Huang

Yuan-Hsiang Huang

Yuan-Chin Huang

Yung-Yu Chan

A cooling device for rack servers and cooling method for rack servers are provided. The cooling device for rack servers includes an environmental temperature sensor, a humidity sensor, a coolant temperature sensor, an electronic valve, and a controller. The controller is configured to compute a dew point temperature according to an ambient temperature and an ambient humidity sensed by the environmental temperature sensor and the humidity sensor, compute a temperature difference between a outlet-liquid temperature of a coolant and the dew point temperature, and control an opening of the electronic valve according to the temperature difference to adjust a liquid flow of the coolant outputted, such that the outlet-liquid temperature dynamically changes following the adjustment of the liquid flow.

Cooling device and cooling method applied to rack server

A precooling device integrated with a cooling distribution unit and a server liquid cooling system are provided. The precooling device includes a liquid cooling row, an adapter assembly, and a cooling distribution unit. The adapter assembly includes a flow joining row and a flow distribution row. The cooling distribution unit supplies a refrigerant from an interior thereof, and includes an outlet and an inlet communicating with the interior. The outlet communicates with the flow distribution row of the adapter assembly to deliver the refrigerant for heat exchange. The refrigerant being performed the heat exchange returns to the liquid cooling row through the flow joining row of the adapter assembly for precooling, and then returns from the liquid cooling row to the cooling distribution unit through the inlet. The refrigerant is precooled before returning to the cooling distribution unit.

Pre-cooling device integrated liquid cooling distributor and its server liquid cooling system

A locking device is provided adjacent to a side opening of a container and includes a handle having a driving section and being pivotally turnably mounted to a top of the container; a long bar-shaped locking member having two opposite ends pivotally connected to the top and a bottom of the container to be turnable toward or away from the side opening; and a return spring mounted on the handle. The locking member includes an upper section located adjacent to the driving section. When the handle is pivotally turned from a horizontal to a vertical position relative to the top, the driving section is turned to drive the upper section for the locking member to pivotally turn toward the side opening. A container using the above locking device is disclosed. When the container is lifted at the handle, the locking member is driven to automatically lock the side opening.

Locking device and container using the same

A fluid immersion cooling system has a fluid tank containing a hydrocarbon dielectric fluid as a coolant fluid. One or more components of an electronic system is immersed in the coolant fluid. A gas cylinder contains a non-flammable, compressed filling gas. The temperature of the coolant fluid is monitored during operation of the electronic system. The filling gas is released from the gas cylinder and into the fluid tank when the temperature of the coolant fluid rises to a trigger temperature that is set based on the flash point of the coolant fluid. The filling gas covers a surface of the coolant fluid to block oxygen from interacting with vapors of the coolant fluid to prevent combustion.

Fluid immersion cooling system with low flash point hydrocarbon dielectric fluid

A three-dimensional image-capturing device includes a first camera, a second camera, a driving member and a sensing member. The second camera is at one side of the first camera and is capable of being moved laterally by the driving member. After depth-sensing and establishing orientations in an image, the driving member is able to drive the second camera to move relative to the first camera, to change a distance between the first camera and the second camera. Such relative movement allows a greater range of three dimensionality for face recognition and other purposes.

Adjustable three-dimensional image-capturing device

A 3D sensing device includes a base, an infrared emitting module, a first infrared receiver, a second infrared receiver, a color camera module, a first moving member, a second moving member, a first driving member, and a second driving member. The first moving member and the second moving member are slidably mounted on the base. The first driving member and the second riving member respectively drive the first moving member and the second moving member to slide along the base. The infrared emitting module is mounted on the first moving member. The color camera module is located between the first infrared receiver and the infrared emitter. The second infrared receiver is mounted on the second moving member. The first moving member and the second moving member respectively move the infrared emitting module and the second infrared receiver along the base relative to the first infrared receiver.

3D sensing camera of electronic device

An encapsulation structure to protect an image sensor chip at all times during manufacture and use includes a printed circuit board, an image sensor chip, a supporting portion, a protecting film and a package portion. The image sensor chip is mounted on the printed circuit board and the supporting portion is mounted on the printed circuit board to surround the image sensor chip. The package portion is entirely opaque and is formed on the printed circuit board, the package portion encloses side wall of the supporting portion and the protecting film, and portion of surface of the protecting sheet away from the image sensor chip.

Encapsulation structure for image sensor chip and method for manufacturing the same

An encapsulating structure to protect an image sensor chip at all times during manufacture and use includes a printed circuit board, an image sensor chip, a protecting sheet, and a package portion. The image sensor chip is mounted on the printed circuit board and the protecting sheet is mounted on the image sensor chip. The package portion is entirely opaque and is formed on the printed circuit board, the package portion encloses side wall of the image sensor chip, the protecting sheet, and portion of surface of the protecting sheet away from the image sensor chip. A method for manufacturing same is also disclosed.

A camera module comprises a circuit board and a base. A circuit board comprises a first surface and a second surface opposite to the first surface. At least one receiving groove is defined in the first surface. The receiving groove has not extended through the second surface. Each the at least one receiving groove receives an electronic component, and a height of the electronic component is less than a depth of the receiving groove. A base is fixed on the top surface. The at least one receiving groove is covered by the base to seal electronic components. A side surface of the base is aligned with a wall of the receiving groove.

Growing community of inventors

Taipei, Taiwan

Chia-Wei Chen