Super Micro Computer, Inc.

Anpec Electronics Corporation

Compal Electronics, Inc.

Pegatron Corporation

Chia-Wei Chen

Chia-Hao Chang

Yung-Fa Lin

Shou-Yi Hsu

Meng-Wei Wu

Main-Gwo Chen

Tienen Chao

Cheng-Hung Lin

Yu Chuan Chang

Hsiao Chung Chen

Tan Hsin Chang

Yueh Ming Liu

Yu Hsiang Huang

Chih-Ta Chen

Ming-Te Hsu

Tzu-Chien Lai

Te-Chang Lin

Yu-Hung Tseng

Yueh-Ming Liu

I-Hsuan Tsai

Yu-Hsiang Huang

Chi-Che Chang

Ya-Lin Liu

Yu-Sheng Lai

Ping-Yao Wu

A driving assistance system and a driving assistance method are provided. The driving assistance system includes a plurality of image capturing devices, a congestion calculation module, and a determination module. The image capturing devices capture a plurality of regional images of a plurality of road sections of the target lane. The congestion calculation module calculates a plurality of congestion levels corresponding to the road sections according to the regional images. The determination module provides a lane changing message to the vehicle according to the congestion levels.

Driving assistance system and driving assistance method

A fluid immersion cooling system includes a fluid tank that contains a layer of a dual-phase coolant fluid and one or more layers of single-phase coolant fluids. The dual-phase and single-phase coolant fluids are immiscible, with the dual-phase coolant fluid having a lower boiling point and higher density than a single-phase coolant fluid. A substrate of an electronic system is submerged in the tank such that high heat-generating components are immersed at least in the layer of the dual-phase coolant fluid. Heat from the components is dissipated to the dual-phase coolant fluid to generate vapor bubbles of the dual-phase coolant fluid. The vapor bubbles rise to a layer of a single-phase coolant fluid that is above the layer of the dual-phase coolant fluid. The vapor bubbles condense to droplets of the dual-phase coolant fluid. The droplets fall down into the layer of the dual-phase coolant fluid.

Fluid immersion cooling system with multiple layers of coolant fluids and method of using same

An electronic device with movable foot pad, including a body and a foot pad module, is provided. The body has a bottom surface. The foot pad module includes a first foot pad, at least one second foot pad, and at least one rotating shaft connecting the first and second foot pads. The second foot pad is rotated relative to the first foot pad by the rotating shaft to switch the foot pad module between first and second states. An axial direction of the rotating shaft is inclined relative to the bottom surface. In the first state, the body is supported on the platform by the first and second foot pads. In the second state, the second foot pad is rotated 180 degrees relative to the first foot pad in the axial direction and protrudes from the first foot pad to support the body on the platform by the second foot pad.

Electronic device with movable foot pad

A cooling apparatus is provided. An external cooling fluid flows into an external inlet opening from an external inlet pipe and passes through a heat exchanger to flow out of an external outlet opening to an external outlet pipe. An internal cooling fluid flows into an internal inlet pipe from the server and flows into an internal inlet opening from the internal inlet pipe and passes through the heat exchanger for heat exchange with the external cooling fluid to flow out of an internal outlet opening to an internal outlet pipe. A hot-swap pump has a pump main body, an inlet anti-leakage pipe, an outlet anti-leakage pipe and a hot-swap connector. The inlet anti-leakage pipe includes an inlet connector and an inlet anti-leakage valve. The outlet anti-leakage pipe includes an outlet connector and an outlet anti-leakage valve. The hot-swap connector is electrically connected to the pump main body.

Cooling apparatus for server

Fluid immersion cooling system with multiple layers of coolant fluids

A pole mount system has an enclosure, an enclosure mounting assembly, and a clamp system. The enclosure mounting assembly is affixed to the exterior of the enclosure. The clamp system grips the pole. The enclosure mounting assembly and the clamp system have complementary fastening structures to secure the enclosure to the pole.

Pole mount system for facilitating installation of heavy telecommunications equipment

A telecommunication cabinet with anti-theft function includes a cabinet body, a cabinet door, a fan module, and a plurality of coupling parts. The cabinet body includes a cabinet and a telecommunication module. The cabinet door covers the cabinet body and is provided with a snap hole. A bottom side of the cabinet door is provided with an installation opening. The fan module includes multiple fans and an elastic clip, and the elastic clip is provided with a bump. When the fan module is placed into the cabinet door from the installation opening, the bump is positioned in the snap hole. The fan module is coupled to the bottom side of the cabinet door.

Telecommunication cabinet with hidden anti-theft heat dissipation module

A telecommunication cabinet includes a cabinet body, a cabinet door module, and a detachable hinge. The cabinet body includes a cabinet and a telecommunication module disposed in the cabinet. The cabinet door module includes a cabinet door and a function module. The detachable hinge includes a first shaft seat, a second shaft seat and a pivot shaft. The cabinet door module is pivotally rotatable with respect to the cabinet through the pivot shaft inserted to the first shaft seat and the second shaft seat. The cabinet door module is detachably coupled to the cabinet body to facilitate replacement.

Telecommunication cabinet with replaceable cabinet door module

A telecommunication cabinet includes a first and a second cabinet bodies, an internal fan, a partition board, multiple heat dissipation pipes and an external fan. The first cabinet body includes an upper slot and a lower slot. The second cabinet body covers the first cabinet body and includes an air inlet and an air outlet. The internal fan is arranged in the first cabinet body. The partition board is connected with the second cabinet body and includes multiple air vents and multiple air intakes. The heat dissipation pipes are disposed in the second cabinet body and include multiple upper nozzles and multiple lower nozzles. Multiple heat dissipation channels are disposed between the heat dissipation pipes. The external fan is disposed on a bottom inside the second cabinet body.

Heat exchange structure of telecommunication cabinet

The present invention provides a trench type power transistor device including a substrate, an epitaxial layer, a doped diffusion region, a doped source region, and a gate structure. The substrate, the doped diffusion region, and the doped source region have a first conductivity type, and the substrate has an active region and a termination region. The epitaxial layer is disposed on the substrate, and has a second conductivity type. The epitaxial layer has a through hole disposed in the active region. The doped diffusion region is disposed in the epitaxial layer at a side of the through hole, and is in contact with the substrate. The doped source region is disposed in the epitaxial layer disposed right on the doped diffusion region, and the gate structure is disposed in the through hole between the doped diffusion region and the doped source region.

Method for fabricating trench type power transistor device

A super junction transistor includes a drain substrate, an epitaxial layer, wherein the epitaxial layer is disposed on the drain substrate, a plurality of gate structure units embedded on the surface of the epitaxial layer, a plurality of trenches disposed in the epitaxial layer between the drain substrate and the gate structure units, a buffer layer in direct contact with the inner surface of the trenches, a plurality of body diffusion regions with a first conductivity type adjacent to the outer surface of the trenches, wherein there is at least a PN junction on the interface between the body diffusion region and the epitaxial layer, and a doped source region, wherein the doped source region is disposed in the epitaxial layer and is adjacent to the gate structure unit.

Super junction transistor and fabrication method thereof

The present invention provides a power transistor device including a substrate, an epitaxial layer, a dopant source layer, a doped drain region, a first insulating layer, a gate structure, a second insulating layer, a doped source region, and a metal layer. The substrate, the doped drain region, and the doped source region have a first conductive type, while the epitaxial layer has a second conductive type. The epitaxial layer is formed on the substrate and has at least one through hole through the epitaxial layer. The first insulating layer, the gate structure, and the second insulating layer are formed sequentially on the substrate in the through hole. The doped drain region and doped source region are formed in the epitaxial layer at one side of the through hole. The metal layer is formed on the epitaxial layer and extends into the through hole to contact the doped source region.

Manufacturing method of power transistor device

A method for fabricating a Schottky device includes the following sequences. First, a substrate with a first conductivity type is provided and an epitaxial layer with the first conductivity type is grown on the substrate. Then, a patterned dielectric layer is formed on the epitaxial layer, and a metal silicide layer is formed on a surface of the epitaxial layer. A dopant source layer with a second conductivity type is formed on the metal silicide layer, followed by applying a thermal drive-in process to diffuse the dopants inside the dopant source layer into the epitaxial layer. Finally, a conductive layer is formed on the metal silicide layer.

Growing community of inventors

Taipei, Taiwan

Chia-Wei Chen