Getac Technology Corporation

Primax Electronics Ltd.

Taiwan Semiconductor Manufacturing Comp. Ltd.

Mediatek Corporation

Bitplay Inc.

National Taiwan University

Asustek Computer Inc.

Richwave Technology Corp.

Button International Co., Ltd.

Unihan Corporation

Inhon International Co., Ltd.

Chia-Wei Chang

Lei-Lung Tsai

Chin-Sung Pan

Chien-Hung Liu

Yao-Chun Chuang

Cheng-Ming Lin

Chien-Chao Huang

Shi-Liang Zhong

Kuang-Yeh Chang

Jong-Yuh Chang

Sheng-Lyang Jang

Jyun-Lin Wu

Boming Hsu

Cheng-Chen Liu

Zong-Syun Lin

Chung-Lung Chen

Chin-Chia Chang

Chien-Chuan Chen

Kun-Huang Hsu

Ju-Min Chen

Hsi-Yang Yeh

Chien-Chih Chung

Yu-Sheng Chen

Tsung-Chin Tsai

Yen-Ting Chu

Wen-Ho Hu

Yan-Han Huang

A semiconductor device may include a compound substrate and a 3-dimensional inductor structure. The compound substrate may include a front surface and a back surface. The 3-dimensional inductor structure may include a front conductive stack, a back conductive layer, and at least one through-hole structure. At least one portion of the front conductive stack may include a first conductive layer disposed on the front surface of the compound substrate, and a second conductive layer disposed on the first conductive layer. The second conductive layer has a thickness ranging between 30 micrometers and 400 micrometers. The back conductive layer is disposed on the back surface of the compound substrate. The at least one through-hole structure penetrates through the compound substrate, and electrically connects the front conductive stack to the back conductive layer.

Semiconductor device for enhancing quality factor of inductor and method of forming the same

A chip-on-wafer-on-substrate (CoWoS) semiconductor assembly is formed which includes a chip-on-wafer (CoW) sub-assembly of integrated circuit (IC) dies mounted on an interposer, which is in turn mounted on a package substrate with a top metallization stack and a bottom metallization stack using bonding bumps connecting the backside of the interposer and the front side of the package substrate. The bonding bumps provide electrical connections between the ends of through-vias exposed at the backside of the interposer and the top metallization stack of the package substrate. The likelihood of certain failure mechanisms that can adversely affect CoWoS yield are reduced or eliminated by ensuring a total metal thickness of the top metallization stack is greater than a total metal thickness of the bottom metallization stack, but not so much greater as to induce cracking of the underfill material during curing thereof.

Chip-on-wafer-on-substrate package with improved yield

A bag set comprises a first bag unit combined with a second bag unit. The first bag unit includes a main bag body and a strap set. The main bag body has two first fasteners disposed on an outer surface. The strap set includes a first strap component having two ends connected with the main bag body, and a second strap component having a loop structure and one end connected with the main bag body. The second bag unit has two second fasteners to be attached to or disassembled from the two first fasteners selectively. When in use, the first strap component is hung diagonally on a shoulder of a user; and the second strap component is extended forward from the waist of the user to make the loop structure positioned in front side of the user, to pass the first strap component through the loop structure.

Bag set and usage method thereof

A resonance detection system includes a vibration simulation mechanism and a vibration audio analysis device. The vibration simulation mechanism includes a mechanism body that accommodates a peripheral interface device, such as a notebook computer key input mechanical structure. The vibration simulation mechanism generates a vibration wave to the peripheral interface device generates a vibration audio signal in response to the vibration wave. The vibration simulation mechanism further includes a patch-type audio collector, such as a miniature auscultation radio patch, which is connected with the vibration audio analysis device. The patch-type audio collector is attached on the mechanism body containing the peripheral interface device. The vibration audio signal is collected by the patch-type audio collector. The vibration audio analysis device judges whether there is an abnormal resonance phenomenon in the vibration auto signal, which may be used for fabrication quality control of peripheral interface devices.

Resonance detection system for peripheral interface device

A key structure includes a base plate, a supporting element, a resilience arm and a keycap. The keycap includes a bulge. The supporting element is installed on the base plate. The resilience arm is connected with the supporting element and aligned with the bulge of the keycap. The keycap is connected with the supporting element. When the keycap is moved toward the base plate, the bulge is moved downwardly to push the resilience arm. After the resilience arm is pushed by the bulge, the resilience arm is subjected to elastic deformation and separated from the bulge. After the resilience arm is separated from the bulge, the resilience arm knocks on the keycap, so that a sound is generated.

Key structure

A keyboard device includes a base plate and a key structure. The base plate includes a first coupling part. The first coupling part includes a first locking hole. The key structure includes a keycap, a stabilizer bar and a first connecting element. The stabilizer bar is arranged between the keycap and the base plate. The stabilizer bar includes a transverse bar part and a first hook part. The transverse bar part is pivotally coupled to the keycap. The first hook part is penetrated through the first locking hole of the first coupling part. The first connecting element includes a first supporting structure. The first supporting structure is arranged between the first hook part of the stabilizer bar and the base plate. The first hook part is supported by the first supporting structure. Consequently, the first hook part is contacted with an inner wall of the first locking hole.

Keyboard device

A key structure includes a keycap and a scissors-type connecting element. The scissors-type connecting element is connected with the keycap. The scissors-type connecting element includes an inner frame and an outer frame. A first end of the inner frame is connected with the keycap. The outer frame is connected with the inner frame and swingable relative to the inner frame. A first end of the outer frame is connected with the keycap and located near a second end of the inner frame. A second end of the inner frame includes a first protrusion. A first end of the outer frame includes a second protrusion near the first protrusion. The first protrusion includes a first knocking surface. The second protrusion includes a second knocking surface. While the keycap is pressed down, the first knocking surface and the second knocking surface knock on each other.

A key structure includes a keycap, a membrane circuit board, and a rubber dome between the keycap and the membrane circuit board. The rubber dome includes a ring-shaped structure, a lower foundation structure, a contacting post, a first inclined wall and a second inclined wall. The ring-shaped structure includes a first top surface. The first top surface is upwardly pushed against the keycap. The lower foundation structure includes a first bottom surface. The first bottom surface is pushed downwardly pushed against the membrane circuit board. The contacting post is connected with the ring-shaped structure. The first inclined wall is connected with the ring-shaped structure and the lower foundation structure. The second inclined wall is connected with the ring-shaped structure and the contacting post. There is a first included angle &#x3b8;between the second inclined wall and the first bottom surface. Preferably, 30&#xb0;&#x2264;&#x3b8;&#x2264;85&#xb0;.

Key structure and rubber dome thereof

A keyboard device includes plural key structures. Each key structure includes a plate assembly, a keycap assembly, an elastic element, a connecting member and a signal generator. The plate assembly includes a membrane switch. The keycap assembly is located over the plate assembly. The elastic element is arranged between the plate assembly and the keycap assembly. The connecting member is arranged between the plate assembly and the keycap assembly. The connecting member includes a triggering part. The signal generator is installed on the plate assembly. While the keycap assembly is moved toward the plate assembly through the connecting member, the triggering part is moved downwardly to trigger the signal generator to generate a first signal. After the signal generator is triggered, the keycap assembly is continuously moved downwardly and the membrane switch is triggered to generate a second signal.

Keyboard device and key structure thereof

A keyboard device includes a key structure and a membrane circuit board. The membrane circuit board includes a membrane switch. The membrane switch is located under the key structure. The key structure includes a pedestal structure, a covering structure, a keycap, a connecting element, a dome-type elastomer and a knocking element. The keycap is installed on the covering structure. The connecting element is connected between the covering structure and the pedestal structure. The dome-type elastomer is arranged between the covering structure and the membrane circuit board. When the keycap is not depressed, the knocking element is supported on the connecting element. While the keycap is depressed, the knocking element knocks on the connecting element to generate an operating sound and provide the operating feedback to the user.

A circuit board and a heat dissipating device are provided. The heat dissipating device is for dissipating heat from a heat element. The heat dissipating device comprises: a base, having a plurality of fixing holes, each of the fixing holes is disposed adjacent to a periphery of the base, each connecting direction is respectively defined according to a connecting line between each of the fixing holes and the adjacent fixing holes; a fin set, disposed on the base and having at least one airflow channel; and a fan assembly, disposed in the fin set to generate an airflow flows through the at least one airflow channel, wherein a vertical projection of the direction of the at least one airflow channel on the base and a vertical projection of the connecting line direction on the base are non-orthogonal and non-parallel.

Circuit board and heat dissipating device thereof

Crashproof corner for portable computer

A method for handling a PDN disconnection request performed by a communications apparatus communicating with a network device includes transmitting a PDN disconnect request message to the network device to request to disconnect a predetermined PDN connection; receiving a PDN disconnect reject message from the network device; obtaining a reject cause carried in the PDN disconnect reject message; and locally deactivating all other PDN connection(s) other than the predetermined PDN connection when the reject cause carried in the PDN disconnect reject message indicates that the last PDN disconnection is not allowed.

Methods for handling a PDN disconnection request and communications apparatus utilizing the same

A hand strap for a portable electronic device is disclosed, wherein the hand strap comprises a fastened portion, a supporting portion and a holding portion. The fastened portion is fixed on a rear surface of the portable electronic device. The supporting portion has a first support body and a second support body. The second support body is rotatable to pivot on the fastened portion in accordance with an axis which is perpendicular to the rear surface of the portable electronic device. In a folded state, the first support body and the second support body are attached to each other. In an extended state, the first support body is inclined an angle corresponding to the second support body so as to support the portable electronic device.

Hand strap

A wireless communication method and device are provided. The wireless communication method includes the steps of receiving a Traffic Flow Template (TFT) which is assigned by a network; determining whether a first evaluation precedence index (EPI) corresponding to a new packet filter of the TFT is the same as a second EPI corresponding to an old packet filter which belongs to an evolved packet system (EPS) bearer or a packet data protocol (PDP) context; determining whether the new packet filter belongs to the EPS bearer or the PDP context when the first EPI is the same as the second EPI; and replacing the old packet filter with the new packet filter without deleting the EPS bearer or the PDP context when the new packet filter belongs to the EPS bearer or the PDP context.

Growing community of inventors

Taipei, Taiwan

Chia-Wei Chang