Intel Corporation

Chia Voon Tan

Bok Eng Cheah

Jackson Chung Peng Kong

Khang Choong Yong

Yun Ling

Techniques and mechanisms for mitigating the effect of signal noise on communication via an interconnect. In an embodiment, a substrate includes an interconnect and a conductor which has a hole formed therein. Portions of the interconnect variously extend over a side of the conductor, wherein another recess portion of the interconnect extends from a plane which includes the side, and further extends at least partially into the hole. The configuration of the recess portion extending within the hole may contribute to an impedance which dampens a transmitter slew rate of the communication. In an embodiment, a total distance along a path formed by the interconnect is equal to or less than 5.5 inches.

Growing community of inventors

Pinang, Malaysia

Chia Voon Tan