Taiwan Semiconductor Manufacturing Comp. Ltd.

Avision Inc.

Chia-Shih Lin

Hao-Ming Chang

Chih-Chiang Tu

Jong-Yuh Chang

Chien-Hung Lai

Biow-Hiem Ong

Chih-Tsung Shih

Yen-Cheng Chen

Chun-Chieh Liao

Ting-Kuo Chu

Yu-Hsin Hsu

Hsuan-Wen Wang

Yu-Hsun Wu

Rick Lai

A method for cleaning a substrate is provided. The method includes following operations. A substrate is received. The substrate includes a first layer over a surface of the substrate and a second layer over the first layer. A plurality of particles are disposed over the surface of the first layer. A first mega sonic agitation is performed on the substrate with applying a first mixture. A second mega sonic agitation is performed on the substrate with applying a second mixture. A frequency of the first mega sonic agitation is greater than 3 MHz, and a frequency of the second mega sonic agitation is greater than 3 MHz. A flow rate of the first mixture is between approximately 1000 ml/min and approximately 5000 ml/min. A flow rate of the second mixture is between 1000 ml/min and approximately 3000 ml/min.

Method for cleaning substrate

A method for cleaning a substrate is provided. The method includes following operations. A substrate is received. The substrate has a plurality of conductive nanoparticles disposed over a surface of the substrate. A first mixture is applied to remove the conductive nanoparticles. The first mixture includes an SCl solution, DI water and O. A second mixture is applied to the photomask substrate. The second mixture includes DI wafer and H. A temperature of the second mixture is between approximately 20&#xb0; C. and 40&#xb0; C. The applying of the second mixture further includes a mega sonic agitation, and a frequency of the mega sonic agitation is greater than 3 MHz. A flow rate of the first mixture is between approximately 1000 ml/min and approximately 5000 ml/min. A flow rate of the second mixture is between 1000 ml/min and approximately 3000 ml/min.

A photomask includes a substrate, a multilayer stack disposed over the substrate and configured to reflect a radiation, a capping layer over the multilayer stack, and an anti-reflective layer over the capping layer. The anti-reflective layer comprises a first pattern, wherein the first pattern exposes the capping layer and is configured as a printable feature. The photomask also includes an absorber spaced apart from the printable feature from a top-view perspective.

Photomask with enhanced contamination control and method of forming the same

A method for cleaning a substrate includes receiving a photomask substrate comprising a multilayered reflective structure disposed over a surface of the photomask substrate, a capping layer disposed on the multilayered reflective structure and an absorber, wherein the photomask substrate has a plurality of conductive nanoparticles disposed over the surface; applying a first mixture comprising a SC1 solution, a DI water and Oto the photomask substrate to remove the conductive nanoparticles; and applying a DI water to rinse the photomask substrate. A removal rate of the conductive nanoparticles is greater than approximately 90%.

The present disclosure provides a method of inspecting a photolithographic mask wherein a design database is received, and a feature of the design database is adjusted by a bias factor to produce a biased database. Image rendering is performed on the biased database to produce a biased image. A mask is also created using the design database, and the mask is imaged to produce a mask image. The biased image is compared to the mask image, and a new value for the bias factor may be determined based on the comparison.

Rendered database image-to-inspection image optimization for inspection

A method of forming a standard mask for an inspection system is provided, the method comprising providing a substrate within a chamber, and providing a tetraethylorthosilicate (TEOS) precursor within the chamber. The method further includes reacting the TEOS precursor with an electron beam to form silicon oxide particles of controlled size at one or more controlled locations on the substrate, the silicon oxide particles disposed as simulated contamination defects.

Contamination inspection

A scanner with a simplified document feeding path is provided for scanning a document. The scanner includes a paper path, a conveying mechanism, an optical module and a scan window. The conveying mechanism conveys the document along the paper path. The optical module, rotatably disposed, captures an image of the document conveyed to a first position and a second position in the paper path, wherein the optical module captures a front-side image of the document at the first position and a back-side image of the document at the second position. The scan window, mounted on the optical module, is turned toward the first position and the second position as the optical module rotates, and the optical module captures the image of the document through the scan window.

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Hsinchu, Taiwan

Chia-Shih Lin