Orient Semiconductor Electronics, Limited

Chia Ming Yang

Hung Lin Chiang

Yueh Ming Tung

Hsiu Fang Tsai

Shu Hui Lin

Hung Yuan Lu

Yi Cheng Lin

Kuo Yang Sun

Wei Chin Tsai

Memory card

A semiconductor package includes a substrate, a first chip, a nonconductive adhesive, a second chip and a plurality of supporting balls. The first chip has an upper surface and a lower surface opposite to the upper surface, and the lower surface is mounted on the substrate. The nonconductive adhesive is disposed on the upper surface of the first chip. The second chip has an upper surface and a lower surface opposite to the upper surface, wherein the lower surface is mounted on the upper surface of the first chip by means of the nonconductive adhesive, and the adherent area between the nonconductive adhesive and the second chip is larger than 90% of the area of the lower surface of the second chip. The supporting balls are disposed in the nonconductive adhesive for supporting the second chip.

Semiconductor package

Growing community of inventors

Tainan, Taiwan

Chia Ming Yang