Lite-on Technology Corporation

Lite-on Electronics (guangzhou) Limited

Silitek Electronic (guangzhou) Co., Ltd.

Via Labs, Inc.

Chia-Ming Tu

Tsung-Kang Ying

Hou-Te Lee

Chia-Hung Chu

Chi-Ju Shen

Hsiao-Chyi Lin

Shih Chung Huang

A USB integrated circuit (IC) includes a first USB port and a second USB port. The first USB port includes a first connecting component pair and a second connecting component pair. The second USB port includes a third connecting component pair and a fourth connecting component pair. The USB IC outputs a first differential signal pair and a third differential signal pair to the outside via the first connecting component pair and the third connecting component pair, and receives a second differential signal pair and a fourth differential signal pair from the outside via the second connecting component pair and the fourth connecting component pair. The first connecting component pair is disposed between the second connecting component pair and the third connecting component pair, and the third connecting component pair is disposed between the first connecting component pair and the fourth connecting component pair.

USB integrated circuit

The instant disclosure provides a light-emitting module and a method of manufacturing a single light-emitting structure. The light-emitting module includes two identical light-emitting structures disposed on the same plane. One of the two light-emitting structures disposed on the plane is rotated by 180 degrees relative to the other light-emitting structure, and the two light-emitting structures are connected to each other. Each light-emitting structure includes a base, a conducting element, a light-emitting element and an encapsulation element. The conducting element includes a plurality of conductors separated from each other and passing through the base body, where the number of the conductors is N and N&#x3e;1. The light-emitting element includes at least one light-emitting chip electrically connected between at least two of the conductors. The encapsulation element includes a transparent encapsulation body disposed on the base to cover the conducting element and the light-emitting element.

Method of manufacturing a single light-emitting structure

Light-emitting module and method of manufacturing a single light-emitting structure thereof

Package carrier

Growing community of inventors

Taipei, Taiwan

Chia-Ming Tu