Taiwan Semiconductor Manufacturing Comp. Ltd.

Chia-Ming Tai

Ding-I Liu

Shao-Yen Ku

Po-Hsiung Leu

Si-Wen Liao

Yong-Hung Yang

Tzu-Yang Chung

Chao-Hui Kuo

Lan Hai Wang

Tai-Liang Lyu

Embodiments of mechanisms for cleaning a wafer are provided. A method for cleaning a wafer includes cleaning a wafer by using a wafer scrubber and cleaning the wafer scrubber in a scrubber cleaning module. An agitated cleaning liquid is applied on the wafer scrubber to clean the wafer scrubber. The method also includes cleaning the wafer or a second wafer by the wafer scrubber after the wafer scrubber is cleaned by the agitated cleaning liquid.

Mechanisms for cleaning wafer and scrubber

A multi chamber thin film deposition apparatus and a method for depositing films, is provided. Each chamber includes a three dimensional gas delivery system including process gases being delivered downwardly toward the substrate and laterally toward the substrate. A pumping system includes an exhaust port in each chamber that is centrally positioned underneath the substrate being processed and therefore the gas flow around all portions of the edge of the substrate are equally spaced from the exhaust port thereby creating a uniform gas flow profile which results in film thickness uniformity of films deposited on both the front and back surfaces of the substrate. The deposited films demonstrate uniform thickness on the front and back of the substrate and extend inwardly to a uniform distance on the periphery of the backside of the substrate.

Thin film deposition apparatus with multi chamber design and film deposition methods

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Taipei, Taiwan

Chia-Ming Tai