Taiwan Semiconductor Manufacturing Comp. Ltd.

Chia-Ming Liang

Yi-Shien Mor

Huai-Hsien Chiu

Jin-Aun Ng

Yi-Juei Lee

Chi-Hsin Chang

Tzu-Jin Yeh

En-Hsiang Yeh

Wen-Sheng Chen

Zong-You Li

Chung-Ho Chai

An IC fabrication method includes forming a first fin on a semiconductor substrate, forming an isolation dielectric material over the first fin, and planarizing the isolation dielectric material. A top surface of the first fin is covered by the isolation dielectric material after planarizing the isolation dielectric material. The method further includes etching back the isolation dielectric material until the first fin protrudes from the isolation dielectric material.

Integrated circuit structure

The measurement method includes operations of applying a first gate bias voltage to a gate terminal of a first transistor that is included in a radio frequency (RF) power amplifier during a direct current (DC) measurement period, wherein the first transistor operates in a linear operation mode during the DC measurement period; measuring a first drain-source voltage of the first transistor and a current flowing through the first transistor via a connection node during the DC measurement period; applying a second gate bias voltage and a drain bias voltage to a gate terminal and a drain terminal of a second transistor that is electrically connected to the first transistor via the connection node; and measuring a DC value of the second transistor via the connection node during the DC measurement period.

Measurement method using radio frequency power amplifier

A method includes forming a first fin on a semiconductor substrate, forming an isolation dielectric material over the first fin, and planarizing the isolation dielectric material. A top surface of the first fin is covered by the isolation dielectric material after planarizing the isolation dielectric material. The method further includes etching back the isolation dielectric material until the first fin protrudes from the isolation dielectric material.

Method of forming semiconductor structure

A semiconductor device includes a substrate, an epitaxial channel structure and a gate structure. The epitaxial channel structure is located above the substrate. The epitaxial channel structure has a bottom and a top. The bottom is between the substrate and the top, and the bottom has a width less than that of the top.

Semiconductor device and method of forming semiconductor fin thereof

A semiconductor structure includes a substrate, a first gate structure, and a second gate structure. The substrate has a plurality of first fins and a plurality of second fins, wherein a first pitch between two adjacent first fins is greater than a second pitch between two adjacent second fins. The first gate structure crosses over the first fins. The second gate structure crosses over the second fins, wherein the second gate structure includes an upper portion having two first sidewalls substantially parallel to each other and a lower portion tapers toward the substrate.

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Taipei, Taiwan

Chia-Ming Liang