Hrl Laboratories, LLC

The Boeing Company

Gm Global Technolgoy Operations, Inc.

Chia-Ming Chang

Geoffrey P McKnight

Peter David Brewer

Joshua M Montgomery

Sevag Terterian

Charbel Abijaoude

Hyok Jae Song

Diego Eduardo Carrasco

Janet M Hogan

Ping Liu

John S Wang

Andrew C Keefe

Adam E Sorensen

Christopher Paul Henry

John J Vajo

William B Carter

Donald Wayne Coffland

Douglas Reinhard Ludin

Adour Vahe Kabakian

Tiffany A Stewart

Thomas A Zientek

Alan Jon Jacobsen

Brian James Koch

Tobias A Schaedler

Jason A Graetz

Florian G Herrault

David W Shahan

Jing Gao

Alok Warey

Adam Robert Weston

Souren Soukiazian

Alfred Zhang

Yan Tang

John Jacob Ottusch

Daniel M Zehnder

John L Visher

Patrick J Webb

Partia Naghibi Mahmoudabadi

Geoffrey P Mcknight

A reversable attachment system includes an adhesion layer, an inter-substrate bond structure, a mating layer and an extension actuator. The adhesion layer is configured to attach to a first substrate. The inter-substrate bond structure is coupled to the adhesion layer. The mating layer is configured to attach to a second substrate. The extension actuator is configured to attach to the second substrate and expand in response to an absorption of a gas. The inter-substrate bond structure is configured to form an initial thermocompression bond with the mating layer in response to an applied pressure and an applied heat. The expansion of the extension actuator in response to absorbing the gas detaches the inter-substrate bond structure from the mating layer.

Reversable attachment system

A method to aid in a calibration of a compression system includes mounting a first substrate in a press. The press has calibration parameters, and the first substrate has a test film on a first surface. The method includes mounting a second substrate in the press. The second substrate has spikes arranged in a spike pattern on a second surface. The method includes compressing the first substrate and the second substrate together with a force that causes the spikes to form indentations in the test film, separating the first substrate from the second substrate, determining local pressures applied by the spikes against the test film, and adjusting one or more calibration parameters of the press in response to the local pressures.

Compression system calibration

An inter-substrate bond structure includes an adhesion layer that attached to a first substrate, and an outer gas-permeable layer coupled to the adhesion layer. The outer gas-permeable layer expands and fractures in response to absorbing a gas. The inter-substrate bond structure includes an outer bond layer coupled to the outer gas-permeable layer. The outer bond layer forms an initial thermocompression bond with a mating layer on a second substrate. The initial thermocompression bond bonds the first substrate to the second substrate with the inter-substrate bond structure. The fracture in the inter-substrate bond structure debonds the first substrate from the second substrate while leaving a first portion of the inter-substrate bond structure attached to the first substrate.

Reworkable inter-substrate bond structure

A probing system includes a device-under-test, a probe device, and a die bonder. The device-under-test includes test patterns. The probe device includes tilt angle sensors. The tilt angle sensors include spikes that protrude from the probe device. The die bonder is operational to mount the device-under-test, mount the probe device facing the device-under-test, compress the probe device and the device-under-test together to causes a subset of the spikes to contact the test patterns, measure a number of connections formed between the tilt angle sensors and the test patterns, determine a first offset angle and a second offset angle between the device-under-test and the probe device based on the number of connections, adjust the spherical positioner in one or more rotational axes in response to the first offset angle and the second offset angle to change a parallelism between the device-under-test and the probe device.

Tilt calibration for probe systems

A method for debonding a bonded part includes attaching a handle to a third side of a first substrate of the bonded part with an adhesive layer. The bonded part has a plurality of inter-substrate bond structures that couple a first side of the first substrate to a second side of a second substrate. The third side of the first substrate is opposite the first side. The first substrate and the second substrate have different thicknesses. The method includes absorbing a solvent into the adhesive layer, swelling the adhesive layer in response to the absorbing of the solvent, bending the first substrate in response to the swelling, and breaking a plurality of thermocompression bonds between the plurality of inter-substrate bond structures and the second side of the second substrate in response to the bending to debond the first substrate.

Substrate debonding from bonded part

A vehicle, and a balancing device and method of controlling a state of charge of a reference electrode in a battery. The balancing device includes a measurement circuit and a charging circuit. The measurement circuit is configured to obtain a measurement of a reference voltage of the reference electrode. The charging circuit is configured to adjust the reference voltage based on the measurement. The state of charge of the reference electrode is controlled based on the reference voltage.

Automated reference electrode management

An electronic assembly including: a wafer defining at least one cavity; a chip disposed in the cavity; and a metal heat spreader disposed in the cavity, the chip being embedded in the metal heat spreader; wherein the metal heat spreader has at least one elongate microstructure separated from a remainder of the metal heat spreader by at least one channel; wherein the metal heat spreader occupies an area within the cavity that is not occupied by the chip; and wherein the at least one elongate microstructure is configured and arranged in the cavity so as to improve thermal management of the chip by reducing stress across the chip as compared with a configuration and arrangement in which a heat spreader made of the metal and occupying the area within the cavity is a solid without channels. Also, a method for forming the electronic assembly.

Wafer-level integrated micro-structured heat spreaders

A system may include a fastener having a trench formed in a side of a head of the fastener. The system may further include a magneto-elastic component spanning the trench and attached to the head of the fastener on both sides of the trench. The system may also include a coil wrapped around the magneto-elastic component between both sides of the trench. The system may include a radio frequency identification (RFID) circuit, where the coil may be electrically connected to the RFID circuit resulting in a resonance response frequency that is a function of a strain level applied to the magneto-elastic component.

Radio-frequency-identification-based smart fastener

A wireless radio-frequency identification (RFID) strain sensor including: a substrate; an antenna on the substrate; and an integrated circuit on the substrate and electrically connected to the antenna. At least one of the substrate and the antenna includes a magnetoelastic material.

Magnetoelastic strain sensor and radio-frequency identification tag including the same

Example methods, panels, and systems are disclosed for providing noise insulation. Noise insulation may be provided by an anti-resonant panel that includes a base panel including a base panel core material and two base panel face sheets, where each of the two base panel face sheets is adjacent to an opposite side of the base panel core material. The anti-resonant panel further includes at least one stiffener-member positioned along the base panel in a defined area of the base panel, where the defined area is less than a full area of the base panel. The stiffener-member includes a stiffener-member core material and two stiffener-member face sheets the stiffener-member face sheets adjacent to an opposite side of the stiffener-member core material.

Anti-resonant panel and methods of making the same

An acoustic absorber is disclosed. The acoustic absorber contains a plurality of adjacent passages defined by walls configured to generate alternating high and low pressure zones as an acoustic energy travels though the acoustic absorber.

Acoustic absorber

An enclosure is disclosed. The enclosure contains a plurality of walls coupled together and configured to al least partially cover one or more components, wherein at least one of the walls comprises a first plurality of antiresonant membranes configured to at least partially block acoustic emission from the one or more components.

Sound blocking enclosures with antiresonant membranes

A system includes a fastener and a magneto-elastic component connected to the fastener, wherein a strain level applied to the magneto-elastic component is a function of a tightness level within a range of tightness levels of the fastener. The system further includes a radio frequency identification (RFID) circuit. The system also includes an antenna electrically connected to the RFID circuit. The system includes a variable inductor circuit electrically connected to the RFID circuit and to the antenna, where an inductance exhibited by the variable inductor circuit is a function of the strain level applied to the magneto-elastic component, where a resonance response frequency of the RFID circuit is a function of the inductance exhibited by the variable inductor circuit, and where a change in the strain level results in a shift in the resonance response frequency.

A thermomagnetic sensor includes a thermomagnetic probe that includes a ferromagnetic material having a temperature-dependent magnetic permeability characterized by a maximum magnetic permeability value at a temperature below a Curie temperature of the ferromagnetic material. The thermomagnetic sensor further includes an alternating magnetic field source to produce an alternating magnetic field in a vicinity of the thermomagnetic probe to facilitate a measurement of the temperature-dependent magnetic permeability as function of temperature remotely using a thermomagnetic effect. A predetermined relationship between the temperature-dependent magnetic permeability and temperature in a range between the maximum magnetic permeability value and the Curie temperature provides a measurement of a temperature local to the thermomagnetic probe. A battery-temperature measurement system includes the thermomagnetic probe in a battery, a magnetic field coil to apply the alternating magnetic field, and a magnetic permeability measurement apparatus to measure the temperature-dependent magnetic permeability.

Thermomagnetic temperature sensing

In one embodiment, a vibration control apparatus is provided having a pair of face sheets with a core material in between. The core material comprising a positive stiffness material. A stack comprising a positive stiffness structure in series with a negative stiffness structure is located between the pair of face sheets, in parallel with the core material. The stack may be embedded in the core material. Various embodiments may include multiple stacks in parallel with each other. In some embodiments, the stack may include multiple positive stiffness structures in series with multiple negative stiffness structures. The multiple positive stiffness structures and negative stiffness structures may be interleaved.

Growing community of inventors

Agoura Hills, CA, United States of America

Chia-Ming Chang