Giga-Byte Technology Co., Ltd.

Chia-Min Chou

Hsiang-Chieh Tseng

Yi-Song Liu

Mou-Ming Ma

Tung-Shan Lee

Chia-Feng Yeh

Shiang-Chich Tseng

A heat-dissipating structure is assembled on a Central Processing Unit, and has a water-cooling device, a fan and a support device. The support device is assembled between the water-cooling device and the fan to form an accommodating space. Hence, the heat-dissipating device can efficiently dissipate the heat from the Central Processing Unit and another electronic element that is disposed in the vicinity of the Central Processing Unit. Furthermore, the air-guiding device can guide the air from the fan to the correct place for cooling the Central Processing Unit or another electronic element.

Heat-dissipating structure with air-guiding device

Heat sink

A heat-dissipating device is provided. The heat-dissipating device is capable of cooperating a cross-flow type fan, mainly comprising a heat-conductive base plate attached with at least one heat-conductive pipe, and fixedly provided with a plurality of fins on the heat-conductive pipe. An air-outlet gap is naturally formed between any two of the adjacent fins, and an accommodating opening is disposed at an identical location on each of said fins. Within the accommodating opening, a cross-flow type fan is further presented. When fan blades of the cross-flow type fan rotating, an airflow thus generated is allowed for uniformly contacting with each of said fins and discharged through said air-outlet gaps. Thereby, not only the significantly raised effect of heat-dissipation of the heat-conductive base plate, but also the effectively reduced working noise due to a parallel path of the airflow with respect to the fins may be obtained.

Heat-dissipating device

The present invention provides a thermoelectric cooling apparatus for cooling an electronic device such as a CPU, or a computer chip. The apparatus cools the electronic device by two stages. In the first stage, a heat absorbing block collects the heat produced by the electronic device and the apparatus pre-cools the electronic device by dissipating a portion of the collected heat in a distant location through a front heat conductive device and a front radiator. Thereby the heat of the electronic device is reduced to a degree that a TEC can efficiently handle. In the second stage, a TEC of the apparatus dissipate the residual of the heat produced by the electronic device through at least a back heat pipe and a back radiator.

Two stage radiation thermoelectric cooling apparatus

Growing community of inventors

Sanchong, Taiwan

Chia-Min Chou