Unimicron Technology Corporation

Inventec Solar Energy Corporation

Chia-Lung Lin

Yu-Hsiang Huang

Chien-Chen Lin

Chun-Hao Chen

Yu Cheng

Chin-Pao Taso

Jung-Wu Chien

Haw Yen

Chien-Hsiang Chou

Yi-Lin Chiang

Chuan Chi Chen

Yu-hsiang Huang

Yu-Ta Cheng

Chuan-Chi Chen

A wiring board includes an insulating layer, a wiring layer and a plurality of conductive columns. The insulating layer has a first surface and a second surface opposite to the first surface. The wiring layer is disposed in the insulating layer and has a third surface and a fourth surface opposite to the third surface. The insulating layer covers the third surface, and the second surface of the insulating layer is flush with the fourth surface of the wiring layer. The conductive columns are disposed in the insulating layer and connected to the wiring layer. The conductive columns extend from the third surface of the wiring layer to the first surface of the insulating layer, and protrude from the first surface.

Wiring board and method of manufacturing the same

A method of forming bifacial solar cell structure is described. The method comprises: performing boron diffusion on an upper surface of a semiconductor substrate to form a P+ region and a boron silicon glass (BSG) layer on the P+ region; stripping the BSG layer to expose the P+ region and stripping a blocking layer on a lower surface of the semiconductor substrate simultaneously; forming a first anti-reflection coating layer on the P+ region; forming sacrifice film on the first anti-reflection coating layer; performing phosphorus diffusion on the lower surface to form an N+ region and a phosphorus silicon glass (PSG) layer on the N+ region; stripping the PSG layer on the N+ region to expose the N+ region and stripping the sacrifice film on the first anti-reflection coating layer simultaneously; and forming a second anti-reflection coating layer on the N+ region.

Method of forming a bifacial solar cell structure

Growing community of inventors

Taoyuan, Taiwan

Chia-Lung Lin