Taiwan Semiconductor Manufacturing Comp. Ltd.

Chia-Li Lin

Ming-Da Cheng

Chen-Shien Chen

Wen-Hsiung Lu

Yu-Chih Huang

In an embodiment, a device includes: a dielectric layer over an active surface of a semiconductor substrate; a conductive via in the dielectric layer, the conductive via including a first copper layer having a non-uniform grain orientation; and a bonding pad over the conductive via and in the dielectric layer, the bonding pad including a second copper layer having a uniform grain orientation, a top surface of the bonding pad being coplanar with a top surface of the dielectric layer.

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Tainan, Taiwan

Chia-Li Lin