Advanced Semiconductor Engineering, Inc.

Chia-Jung Tsai

Ho-Ming Tong

Teck-Chong Lee

Chao-Fu Weng

Chian-Chi Lin

Kao-Ming Su

Chih-nan Wei

Song-Fu Yang

A wire-bonding method for a wire-bonding apparatus is provided. The wire-bonding apparatus includes at least a first wire-bonder and a second wire-bonder for respectively bonding at least several first chips in a first region and several second chips in a second region on a substrate simultaneously. The wire-bonding method includes following steps. First, initial position coordinates of the first region and the second region are obtained. Next, it is determined whether a space between the first region and the second region is greater than a predetermined space. When the space between the first region and the second region is greater than the predetermined space, the first wire-bonder and the second wire-bonder respectively bond the first chips and the second chips simultaneously.

Wire-bonding method for wire-bonding apparatus

A die bonder and a die bonding method thereof are provided. The die bonder includes a wafer platform, an arranging platform, a conveyer, at least one first pick-up device and a second pick-up device. The wafer platform is for placing a wafer with several dies. The conveyer is for carrying and conveying a substrate. The first pick-up device is for picking up one of the dies and placing each die on the arranging platform. The second pick-up device is for picking up the dies on the arranging platform and placing the dies on the substrate at the same time.

Two-stage die-bonding method for simultaneous die-bonding of multiple dies

Growing community of inventors

Tainan, Taiwan

Chia-Jung Tsai