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Taiwan Semiconductor Manufacturing Comp. Ltd.

Chia Jung Chang

Jichen Wu

Wen Chuan Chen

Ching-Hsi Nan

Yu-Hsiu Fu

Kuo Feng Peng

A method of making a semiconductor device includes collecting process control parameters during operation of a processing tool processing a product. The method further includes calculating a processing tool offset for the processing tool based on the collected process control parameters and calculating a product offset based on the collected process control parameters. The method further includes determining whether the product offset is stable and calculating an offset time for processing the product using the processing tool based on the calculated processing tool offset if the product offset is stable.

Component control in semiconductor performance processing with stable product offsets

An auto-adjusting electric rear-view mirror includes at least two driving mechanisms for driving the rear-view mirror to deflect. The driving mechanisms are respectively coupled to servo control circuits that are further connected to sensor members. The servo control circuits are also coupled to a master control circuit that is further connected to an external controller. The sensor members can sense a positional variation of the rear-view mirror and send a feedback signal to the servo control circuits. The servo control circuits compare a signal from input ports thereof with the feedback signal, and output a control signal to the driving mechanisms according to the comparison result to drive position or negative rotation of the driving mechanisms, such that the rear-view mirror would automatically adjust its view angle to ensure driving safety.

Door lock transmission element

The structure of stacked integrated circuits includes a substrate, a lower integrated circuit, a plurality of wirings, an adhesive layer, and an upper integrated circuit. The substrate has a first surface formed with signal input terminals, and a second surface formed with signal output terminals. The lower integrated circuit has a first surface and a second surface. The first surface is adhered to the first surface of the substrate while the second surface is formed with a plurality of bonding pads. The wirings have first ends and second ends. The first ends are electrically connected to the bonding pads of the lower integrated circuit while the second ends are electrically connected to the signal input terminals of the substrate. The adhesive layer is coated on the second surface of the lower integrated circuit and includes adhesive agent and filling elements. The upper integrated circuit is stacked above the second surface of the lower integrated circuit with the adhesive layer inserted between the upper and lower integrated circuit. The lower integrated circuit is adhered to the upper integrated circuit by the adhesive agent. A predetermined gap is formed between the lower and upper integrated circuit by the filling elements. According to this structure, the wirings located under the lower integrated circuit are free from being pressed and damaged by the upper integrated circuit when stacking a plurality of integrated circuits. Thus, the stacking processes can be facilitated and the manufacturing costs can also be lowered.

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Bancio City, Taipei County, Taiwan

Chia Jung Chang