Taiwan Semiconductor Manufacturing Comp. Ltd.

Chia-Jui Yu

Chun-Lin Tsai

Yao-Chung Chang

Shih-Chien Liu

Various embodiments of the present disclosure are directed towards a three-dimensional (3D) IC comprising semiconductor substrates with different bandgaps. The 3D IC chip comprises a first IC chip and a second IC chip overlying and bonded to the first IC chip. The first IC chip comprises a first semiconductor substrate with a first bandgap, and further comprises and a first device on and partially formed by the first semiconductor substrate. The second IC chip comprises a second semiconductor substrate with a second bandgap different than the first bandgap, and further comprises a second device on the second semiconductor substrate.

Growing community of inventors

Hsinchu County, Taiwan

Chia-Jui Yu