Harvatek Corporation

Chia-Hung Pan

Shyi-Ming Pan

Zhi-Ting Ye

Ping-Lung Wang

A headlamp module comprises a connecting base, a substrate, and at least two edge-type light emitting diode (LED) units. The at least two edge-type LED units are mounted to opposite surfaces of the substrate facing away from each other. Each edge-type LED unit comprises an LED chip, a wavelength converting layer, and a light reflecting layer. The LED chip comprises a bottom surface, a light emitting surface facing away from the bottom surface, and first sidewalls. The wavelength converting layer covers the light emitting surface and the first sidewalls. The wavelength converting layer converts emitted light to a desired range of wavelengths. The light reflecting layer reflects the converted light toward the second sidewalls, thus expanding the angle and brightness of light around the headlamp module and avoiding an unlit or dark area immediately around the headlamp module.

Headlamp module

A light source module includes a light guide plate, a reflecting film, and a plurality of edge-type light emitting diode (LED) units. Grooves are defined in a lower surface of the light guide plate. The reflecting film is below the lower surface and covers the entire lower surface and the grooves. An air gap is defined between the reflecting film and the lower surface. The edge-type LED units are located in the grooves. Each edge-type LED unit includes an LED chip, a wavelength converting layer, and a light reflecting layer. Light emitted is converted by the wavelength converting layer, reflected towards sidewalls of the wavelength converting layer, and transmitted to the lower surface. The reflecting film reflects light that enters the air gap towards an upper surface of the light guide plate, enabling uniform emission of light from the upper surface.

Light source module

A light emitting device includes a side-emitting assembly, a reflecting cup arranged on a side of the side-emitting assembly, and a package for accommodating the side-emitting assembly and the reflecting cup. The side-emitting assembly with a side surface includes a light emitting chip, a wavelength conversion layer coated on the light emitting chip, and a reflecting layer arranged above the wavelength conversion layer. The reflecting cup has an inner surface facing the side surface of the side-emitting assembly. The inner surface of the reflecting cup is a multifocal paraboloid. The multifocal paraboloid includes multistage paraboloids. The corresponding focal points of the multistage paraboloids are symmetrically distributed on the side surface of the side-emitting assembly.

Growing community of inventors

Hsinchu, Taiwan

Chia-Hung Pan