Raydium Semiconductor Corporation

United Lighting Opto-Electronic Inc.

Chia-Hung Hsu

Chin-Yung Chen

Chung-Cheng Chou

William Wang

Chien-Hua Wu

Chi-Wen Kuo

Ching-San Lin

Tsung-Hsien Chou

Chiang-Ching Wang

Jun-Zhou Chen

A die structure and a die connecting method using the same are provided. The die structure includes a die and a bump structure. The bump structure includes a body and a solder layer. The body is disposed on the die. The solder layer is disposed on the body. The method includes providing a die structure mentioned above, providing a circuit board mentioned above, and soldering the solder layer of the die structure with the tine layer on the copper block of the circuit board. In different embodiments, a tin layer is omitted from the circuit board, wherein the solder layer of the die structure is directly soldered onto the surface of the copper block.

Die structure and die connecting method

The invention discloses a touch sensing device, which includes a containing space, a first substrate layer, a second substrate layer, a driver, and a sensor. The first substrate layer and the second substrate layer define the containing space for containing a fluid. The driver can provide charges to a first conducting layer of the first substrate layer, a second conducting layer of the second substrate layer, and the fluid. The sensor can sense the electric characteristics of the fluid. When a point unit approaches the touch sensing device and influences the charges, the appearance of the fluid could be changed and then the electric characteristics could also be changed.

Touch sensing device and touch sensing apparatus

A flexible light-emitting apparatus including a side light-emitting flexible light guide rod, two light emitting diodes, and two lenses is provided. The side light-emitting flexible light guide rod has a first end, a second end opposite to the first end, and a light-emitting surface connecting the first and the second ends. The LEDs are respectively disposed beside the first end and the second end and adapted for emitting light beams toward the side light-emitting flexible light guide rod, respectively. One of the lenses is located between the first end and the LED disposed beside the first end, and the other lens is located between the second end and the LED disposed beside the second end. Each of the light beams enters the side light-emitting flexible light guide rod through the corresponding lens and is transmitted to the outside of the side light-emitting flexible light guide rod through the light-emitting surface.

Flexible light-emitting apparatus

The invention discloses an integrated circuit package. The integrated circuit package comprises a substrate having a first surface and a second surface opposite thereto and a first hole passing through the substrate from the first surface to the second surface. A plurality of conductive lines is disposed on a portion of the second surface of the substrate. A semiconductor chip is disposed above the second surface of the substrate, wherein a chamber is formed between the semiconductor chip and the substrate. A plurality of bonding pads are disposed on a side of the semiconductor chip which is toward the second surface of the substrate, wherein at least one of the bonding pads are electrically connected to one of the plurality of conductive lines. A first heat dissipation layer is disposed in the first hole, and extends into the chamber. A method for fabricating the integrated circuit package is also provided.

Integrated circuit package and fabricating method thereof

Growing community of inventors

Taipei County, Taiwan

Chia-Hung Hsu