Uneo Incorporated

Universal Cement Corporation

Industrial Technology Research Institute

Chia-Hung Chou

Chih-Sheng Hou

Yann-Cherng Chern

Chih Sheng Hou

Hsin-Lin Yu

Cheng-Tsung Chen

Chia-Chieh Chang

Han-Ying Lei

Yi-Ling Chen

Si-Wei Chen

Chueh Chiang

Cheng-Yen Tsai

The present invention relates to an extension structure of flexible substrates with conductive wires thereon. In a first embodiment, three flexible substrates are prepared, each having multiple conductive wires configured on their front surfaces. The third flexible substrate is flipped over, with its conductive wires facing downwards, and bonded across a boundary formed by the first and second flexible substrates. As a result, the corresponding conductive wires between the first and second flexible substrates are electrically coupled with each other through being physically pressed by corresponding conductive wires in the third flexible substrate.

Extension structure of flexible substrates with conductive wires thereon

A cantilever force sensor with relatively lower On-Force is disclosed, which comprises a top stack, a bottom stack, and a spacer. The first spacer is configured between the top stack and the bottom stack and configured in a first side of the force sensor. A second side, opposite to the first side, of the top stack, is cantilevered from the bottom stack. When the force sensor is depressed from the top side, the second side of the top stack moves down using the first spacer as a fulcrum. Since the cantilevered side can be easily depressed down so that the On-Force for the force sensor is reduced and hence a force sensor with a relatively higher sensitivity is created.

Cantilever force sensor

A fast response force sensor is disclosed. The fast response force sensor comprises a solid-state bonding (SSB) spacer and piezo material therein. The SSB spacer is sandwiched between a top stack and a bottom stack of the force sensor. The SSB spacer maintains a fixed relative position between a top stack and a bottom stack of the force sensor when a fixed force is applied or removed. The SSB spacer is in solid state and shall not be significantly deformed while being depressed by a user, and therefore the response time of an output signal is vastly determined by the properties of the piezo material of the force sensor when a force is applied against the force sensor. Therefore, a fast response force sensor can respond quickly to a force applied against it.

Piezo force sensor with solid-state bonding spacer

A force sensing structure and a force sensing device including the same are provided. The force sensing structure is configured to detect a proximity of an object to the force sensor from an upside and a force applied by the object to the force touch sensor. The force sensing structure includes a first electrode and a first capacitance material layer. The first capacitance material layer is disposed adjacent to the first electrode. When the object approaches the force touch sensor, the force touch sensor is configured to detect the proximity of the object according to a first capacitance variation, and when the object contacts the force sensor and deforms of the first capacitance material layer, the force touch sensor is configured to detect the force applied by the object according to a second capacitance variation.

Force sensing structure and force sensing device including the same

A force sensing module is disclosed. One of the embodiments disclosed a first force sensor, and a second force sensor stacked on a top surface of the first force sensor; a signal processing circuit electrically coupled to the first signal force sensor and the second force sensor; when a force is applied on a top surface of the stack, a corresponding force signal is generated; wherein a strength of the force signal is related to an amount of the force applied against the stack.

Force sensing module

An embedded button without having gap is disclosed according to the present invention. The button area just bends to operate instead of moving back and forth to operate within a through hole so that no water, vapor, or dust shall enter into the device. One of the embodiment comprises an inner bump configured on an inner side of an outer frame; a pressure switch is configured under the inner bump and touches the bottom surface of the bump; and an activating electrical signal is triggered when the button area is pressed by user with a force exceeding a threshold force level from outside surface of the outer frame of the electronic device.

Embedded button for an electronic device

A green headphone is disclosed. A force sensor is configured between a speaker cover and a cushion of the headphone. The headphone switches on automatically to play audio when a user puts the headphone on his head. The headphone switches off automatically to stop playing audio when a user puts the headphone off his head, the power consumption is saved.

Green headphone

An instant response pressure sensor is disclosed. An embodiment shows no continuous gap is configured between a piezoresistor and neighboring element(s) in thickness direction. The instant response pressure sensor is able to respond immediately to an extremely small pressure applied thereupon in the early stage with an extremely small distance movement because the instant response pressure sensor without having an extra press journey to move before trigging.

Instant response pressure sensor

A key switch is disclosed. The key switch includes an axis, a pressure sensor layer, an axis component, and a key cap. The axis support includes a first opening. The pressure sensor layer is made of a pressure-sensitive electronic material and disposed on an upper surface of the axis support. The axis component is disposed in the first opening and vertically movable with respect to the axis support and the pressure sensor layer. The keycap is mounted on the axis component and includes a lower surface facing the upper surface of the axis support. When the keycap is depressed, the lower surface of the keycap depresses the pressure sensor layer and an electronic property of the pressure sensor layer varies. An analog pressure detection system including the key switch is also disclosed.

Key switch and analog pressure detection system including the same

A flexible circuit board based force sensor is disclosed. A flexible circuit having a first metal pad and a second metal pad, the flexible circuit board is folded so that the first metal pad functioning as a top metal pad and the bottom metal pad functioning as a bottom metal pad. A force sensing material is configured in between the top metal pad and the bottom metal pad to form a force sensor. An electronic drawing system adopts the flexible circuit board based force sensor in an electronic pen for sensing pressures applied against the pen tip of the electronic pen.

Flexible circuit board based force sensor

A light emitting key is disclosed. A through hole is made through piezoresistive layer; a light source is arranged under the bottom of the light emitting key. When the light source is turned on, light beams shall emit out of the top substrate. The light emitting effect of the key facilitates it to be used in a dark area such as an aircraft flying in the night sky.

Light emitting key

A D/A integrated pressure key for a keyboard is shown. A digital signal output first when a pressure is applied on the single key, and then an analog signal output while applying a bigger pressure over the same key. The magnitude of the analog signal output is positively related to the magnitude of the pressure applied on the integrated pressure key.

Pressure key

A micro-deformable piezoresistive material is provided, including a hard plastic body, a micro-deformable rough texture surface, and a plurality of conductive particles. The micro-deformable rough texture surface is formed on a side of the hard plastic body, wherein the maximum deformation of the rough texture surface is far less than the thickness of the hard plastic body. Additionally, the conductive particles are evenly dispersed in the plastic body.

Micro-deformable piezoresistive material and manufacturing method thereof and pressure sensor using the same

A pressure guiding bump is configured on the center of a pressure gauge to obtain a single 'conductivity--pressure' curve feature which is independent from any position wherever a pressure is applied on the guiding bump. When a pressure is applied, the guiding bump guides the pressure against a fixed deformable area to be deformed, whatever the pressure is, the deformed area is nearly a same area. The pressure gauge is extraordinarily adequate to be designed in a weighing machine with parallel connection in between them.

Pressure sensor with fixed deformable area

A pressure sensor is provided, wherein a ballast resistive layer is integrated in the pressure sensor so that the resistive output curve for the pressure sensor has saturation characteristics. The pressure sensor shall be prevented from breaking down by a large current that may be caused, when an overload pressure is applied on the pressure sensor, if no ballast resistive layer is added.

Growing community of inventors

Taipei, Taiwan

Chia-Hung Chou