Winbond Electronics Corporation

Chia-Hua Ho

Frederick Chen

Ping-Kun Wang

Shao-Ching Liao

Ting-Ying Shen

Po-Yen Hsu

Bo-Lun Wu

Ming-Che Lin

Meng-Hung Lin

Chien-Min Wu

Chih-Cheng Fu

Shuo-Che Chang

Min-Chih Wei

Hsiu-Han Liao

Yu-Ting Chen

Yi-Hsiu Chen

Chuan-Sheng Chou

Provided is a method of fabricating a resistive memory including forming a first electrode and a second electrode opposite to each other; forming a variable resistance layer between the first electrode and the second electrode; forming an oxygen exchange layer between the variable resistance layer and the second electrode; and forming a protection layer at least covering sidewalls of the oxygen exchange layer.

Method of fabricating resistive memory

A power on reset method for a resistive memory storage device is provided and includes performing a forming procedure on a memory cell of the resistive memory storage device. The forming procedure includes applying at least one forming voltage and at least one reset voltage to the memory cell. The forming procedure further includes a thermal step. The step of applying at least one reset voltage to the memory cell may be preformed before or after the thermal step. After one forming voltage is applied, if the memory cell passes verification, the next forming voltage is not applied to the memory cell. After the thermal step, if the memory cell passes verification, the next forming voltage is not applied to the memory cell. In addition, after one reset voltage is applied, if the memory cell passes verification, the next reset voltage is not applied to the memory cell.

Power on reset method for resistive memory storage device

A forming method of a resistive memory device is provided. The forming method includes: conducting a forming procedure to apply a forming voltage to the resistive memory device such that the resistive memory device changes from a high resistive state to a low resistive state and measuring a first current of the resistive memory device; performing a thermal step on the resistive memory device and measuring a second current of the resistive memory device; and comparing the second current to the first current and determining to apply a first voltage signal or a second voltage signal to the resistive memory device or to finish the forming procedure according to a comparison result of the first current and the second current. In addition, a memory storage apparatus including a resistive memory device is also provided.

Memory storage apparatus and forming method of resistive memory device

A resistive random access memory is provided. The resistive random access memory includes a bottom electrode over a substrate, a top electrode, a resistance-switching layer, an oxygen exchange layer, and a sidewall protective layer. The top electrode is disposed over the bottom electrode. The resistance-switching layer is disposed between the bottom electrode and the top electrode. The oxygen exchange layer is disposed between the resistance-switching layer and the top electrode. The sidewall protective layer containing metal or semiconductor is disposed at sidewalls of the resistance-switching layer, and the sidewalls of the resistance-switching layer is doped with the metal or semiconductor from the sidewall protective layer.

Resistive random access memory

Provided are a resistive memory and a method of fabricating the resistive memory. The resistive memory includes a first electrode, a second electrode, a variable resistance layer, an oxygen exchange layer, and a protection layer. The first electrode and the second electrode are arranged opposite to each other. The variable resistance layer is arranged between the first electrode and the second electrode. The oxygen exchange layer is arranged between the variable resistance layer and the second electrode. The protection layer is arranged at least on sidewalls of the oxygen exchange layer.

Resistive memory and method of fabricating the same

A memory storage apparatus including a memory cell array and a memory control circuit is provided. The memory cell array includes a plurality of memory cells. The memory cell array is configured to store data. The memory control circuit is coupled to the memory cell array. The memory control circuit is configured to apply one of a set signal and a reset signal to a target memory cell among the memory cells to generate a read current. The memory control circuit receives a read current of the target memory cell. The memory control circuit compares the read current with a reference current. The memory control circuit determines whether the target memory cell is failed according to a comparison result. In addition, a method for testing a memory storage apparatus is also provided.

Memory storage apparatus and method for testing memory storage apparatus

A resistive memory apparatus and a setting method for a resistive memory cell thereof are provided. The setting method includes: performing a first setting operation on the resistive memory cell, and performing a first verifying operation on the resistive memory cell after the first setting operation is finished; determining whether to perform a first resetting operation on the resistive memory cell according to a verifying result of the first verifying operation, and performing a second verifying operation on the resistive memory cell after the first resetting operation is determined to be performed and is finished; and determining whether to perform a second resetting operation on the resistive memory cell according to a verifying result of the second verifying operation, and performing a third verifying operation on the resistive memory cell after the second resetting operation is determined to be performed and is finished.

Resistive memory apparatus and setting method for resistive memory cell thereof

A data read method and a non-volatile memory apparatus using the same are provided. The data read method includes: obtaining a first read current and a second read current from a memory cell pair of the non-volatile memory; performing a calculation operation according to the first read current and the second read current to obtain a calculation result; and determining a logical state of the memory cell pair according to the calculation result. The calculation operation includes at least a signal addition operation and a signal multiplying operation.

Data read method and a non-volatile memory apparatus using the same

Provided is a three-dimensional resistive memory including a channel pillar, a first gate pillar, a first gate dielectric layer, first and second stacked structures, a variable resistance pillar and an electrode pillar. The channel pillar is on a substrate. The first gate pillar is on the substrate and at a first side of the channel pillar. The first gate dielectric layer is between the channel pillar and the first gate pillar. The first and second stacked structures are on the substrate and respectively at opposite second and third sides of the channel pillar. Each of the first and second stacked structures includes conductive material layers and insulating material layers alternately stacked. The variable resistance pillar is on the substrate and at a side of the first stacked structure opposite to the channel pillar. The electrode pillar is on the substrate and inside of the variable resistance pillar.

Three-dimensional resistive memory

A resistive random access memory includes a first electrode layer, a second electrode layer, and a stacked structure disposed between the first electrode layer and the second electrode layer. The stacked structure includes a conductive layer and a resistance variable layer. The material of the conductive layer includes HfO, the material of the resistance variable layer includes HfO, and x&#x3c;y. Additionally, the diffusion rate of oxygen ions in the conductive layer is lower than the diffusion rate of the oxygen ions in metal.

Resistive random access memory and method of fabricating the same

The invention provides a memory device and a manufacturing method thereof. The memory device includes a substrate, a capacitor, a protection device, a first metal interconnect, and a second metal interconnect. The capacitor is located on the substrate of a first region. The protection device is located in the substrate of a second region. The capacitor includes a plurality of bottom electrodes, a top electrode, and a capacitor dielectric layer. The top electrode has a first portion and a second portion, wherein the second portion is extended to the second region. The capacitor dielectric layer is located between the bottom electrodes and the top electrode. The first metal interconnect is located between the capacitor and the substrate. The second metal interconnect is located between the second portion of the top electrode and the protection device. The top electrode is electrically connected to the protection device through the second metal interconnect.

Memory device and method of manufacturing the same

Provided is a resistive random access memory including a first electrode layer, a second electrode layer, and a variable resistance layer disposed between the first electrode layer and the second electrode layer, wherein the second electrode layer includes a first sublayer, a second sublayer, and a conductive metal oxynitride layer disposed between the first sublayer and the second sublayer.

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Taichung, Taiwan

Chia-Hua Ho