Taiwan Semiconductor Manufacturing Comp. Ltd.

Chia-Hsun Chang

Keith Kuang-Kuo Koai

Wai Hong Cheah

Shih-Kuo Liu

Ming-Chuan Hung

Liang-Guang Chen

Chih Hung Chen

Chyi Shyuan Chern

Wen-Chih Wang

Tzu Kai Lin

Ji James Cui

Jim-Wei Wu

Li Tseng

An apparatus includes a casing configured to be detachably mounted on a workpiece. The casing includes a first opening configured to expose a portion of the workpiece; a first support member coupled to the casing and constructed to move along a first axis through the casing and rotate around the first axis; a second support member coupled to the first support member and constructed to move along a second axis perpendicular to the first axis; an arm pivotally coupled to the second support member and constructed to rotate around a third axis perpendicular to the first axis and the second axis; and a cleaning head attached to the arm and constructed to rotate around a longitudinal axis of the arm. The casing includes a first plate and a second plate opposite to the first plate, wherein the cleaning head is configured to extend outside the casing through the first opening.

Apparatus for cleaning semiconductor equipment

The present disclosure provides a wet chemical heating system, including a first conduit for transporting wet chemical, a dispensing head connected to the first conduit, and a radiative heating element configured to heat the wet chemical in the first conduit and positioned at an upper stream of the dispensing head.

Wet chemical heating system and a method of chemical mechanical polishing

An apparatus includes a first support member coupled to a casing and constructed to move along a first axis through the casing and rotate around the first axis, a second support member coupled to the first support member and constructed to move along a second axis perpendicular to the first axis, and an arm pivotally coupled to the second support member and constructed to rotate around a third axis perpendicular to the first axis and the second axis. The apparatus also includes a cleaning head attached to the arm and constructed to rotate around a longitudinal axis of the arm.

The present disclosure provides a method for fabricating a magnetic semiconductor device, including receiving a semiconductor wafer, disposing the semiconductor wafer under a first electromagnetic element, wherein the first electromagnetic element comprises a primary dimension and a secondary dimension from a top view perspective, the primary dimension being greater than the secondary dimension, and displacing the semiconductor wafer along a predetermined path along the secondary dimension of the first electromagnetic element.

Apparatus for polarizing a semiconductor wafer and method for fabricating a magnetic semiconductor device

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Changhua County, Taiwan

Chia-Hsun Chang