Taiwan Semiconductor Manufacturing Comp. Ltd.

Tsinghua University

Xintec Corporation

Apple Inc.

Chia-Hsiang Chen

Tien-Wei Chiang

Meng-Chun Shih

Harry-Hak-Lay Chuang

Ching-Huang Wang

Chia Yu Wang

Chih-Yang Chang

Kuo-An Liu

Han-Liang Tseng

Chih-Hui Weng

Jiun-Yen Lai

Chih-Chien Hung

Huan-Chi Tseng

Ming-Fa Chen

Zhiqiang Wu

Huan-Chieh Su

Tri-Rung Yew

Chung-Cheng Wu

Abbas Jamshidi Roudbari

Warren S Rieutort-Louis

Yen-Chieh Huang

Kuo-Sheng Chuang

Chih-Heng Shen

Jae Won Choi

Ying-Chen Chao

Yuchi Che

Li-Kong Turn

Gwan-Sin Chang

Ching-Sang Chuang

Hsien-Wen Chang

Chao-Hsin Chang

Chien-Ya Lee

Harry-hak-lay Chuang

Fu-Tien Wong

Han-Ming Sheng

Han-Yi Chen

Ji-Chung Huang

Yi-Chu Wang

Chi-Shen Lo

Kyounghwan Kim

Wen-I Hsieh

Kuo-Liang Liu

Hsiang-Chung Liu

Ming-Huei Tseng

Jonathan H Beck

De-Ming Liang

Chun-Mei Lee

Jhy-Sheng Sheu

Ming E Tai

Ming-Hsiung Wu

Kuan-Yan Huang

In some embodiments, the present application provides an integrated chip. The integrated chip includes a chip comprising a semiconductor device. A shielding structure abuts the chip. The shielding structure comprises a first horizontal region adjacent to a first horizontal surface of the chip. The first horizontal region comprises a first multilayer structure comprising a first dielectric layer and two or more metal layers. The first dielectric layer is disposed between the two or more metal layers.

DC and AC magnetic field protection for MRAM device using magnetic-field-shielding structure

A package structure includes a mounting pad having a mounting surface; a semiconductor chip having a magnetic device, a first magnetic field shielding, and a molding. The semiconductor chip comprises a first surface perpendicular to a thickness direction of the semiconductor chip, a second surface opposite to the first surface, wherein the second surface is attached to the mounting surface of the mounting pad, and a third surface connecting the first surface and the second surface. The first magnetic field shielding including a plurality of segments laterally at least partially surrounding the semiconductor chip, wherein a bottom surface of the first magnetic field shielding is attached to the mounting surface of the mounting pad, wherein the mounting surface comprises first portion free from overlapping with the first magnetic field shielding from a top view perspective. The molding surrounding the mounting pad and in direct contact with the mounting surface.

Package structure and method for fabricating the same

The present disclosure describes a magnetic memory device. The magnetic memory device includes a magnetic sensing array configured to sense an external magnetic field strength. The magnetic memory device further includes a voltage modulator configured to, in response to the external magnetic field strength being greater than a threshold magnetic field strength, provide a test voltage different from a current write voltage of the magnetic memory device. The magnetic memory device further includes an error check array configured to use the test voltage as a write voltage of the error check array and provide a bit error rate corresponding to the test voltage. The magnetic memory device further includes a control unit configured to adjust, based on the bit error rate being equal to or less than a threshold bit error rate, a write voltage of the magnetic memory device from the current write voltage to the test voltage.

Magnetic memory device

A chip structure includes a first substrate, a second substrate, a conductive via, and a redistribution layer. The first substrate has a first inclined sidewall. The second substrate is located on a bottom surface of the first substrate, and has an upper portion and a lower portion. The lower portion extends from the upper portion. The upper portion is between the first substrate and the lower portion. The upper portion has a second inclined sidewall, and a slope of the first inclined sidewall is substantially equal to a slope of the second inclined sidewall. The conductive via is in the lower portion. The redistribution layer extends from a top surface of the first substrate to a top surface of the lower portion of the second substrate sequentially along the first inclined sidewall and the second inclined sidewall, and is electrically connected to the conductive via.

Chip structure and manufacturing method thereof

An electronic device may have a display with an active area configured to display images and an inactive area that is free of pixels and that does not display images. Touch sensor sense lines may have portions located in the active area and portions located in the inactive area. The active and inactive areas may be characterized by respective reflectivity values. To match the reflectivities of the active and inactive areas and thereby avoid undesired visually distinguishable differences in the appearances of these areas, the touch sensor circuitry in the inactive areas may be configured to match the reflectivity values of the active and inactive areas. Sense line portions in the inactive area may have metal traces of enhanced reflectivity and/or uneven surface topology to enhance ambient light reflections through a circular polarizer that overlaps the active and inactive areas.

Electronic device displays with visibly matched borders

The present disclosure provides a package structure, including a mounting pad having a mounting surface, a semiconductor chip disposed on the mounting surface of the mounting pad, wherein the semiconductor chip includes a first surface, a second surface opposite to the first surface and facing the mounting surface, and a third surface connecting the first surface and the second surface, a first magnetic field shielding, including a first portion proximal to the third surface of the semiconductor chip, wherein the first portion has a first height calculated from the mounting surface to a top surface, and a second portion distal to the semiconductor chip, has a second height calculated from the mounting surface to a position at a surface facing away from the mounting surface, wherein the second height is less than the first height, wherein the second portion has an inclined sidewall.

In a method of testing a multilayer structure containing a magnetic layer, one or more network parameters are measured of a waveguide that is electromagnetically coupled with the multilayer structure as a function of frequency and as a function of a magnetic field applied to the multilayer structure during the measuring of the network parameters. Based on the measured one or more network parameters, at least one magnetic property of the magnetic layer of the multilayer structure is determined. The network parameters in some embodiments are S-parameters. The at least one magnetic property may include an effective anisotropy field of the magnetic layer and/or a damping constant of the magnetic layer.

Magnetic layer characterization system and method

In some embodiments, a method for generating a random bit is provided. The method includes generating a first random bit by providing a random number generator (RNG) signal to a magnetoresistive random-access memory (MRAM) cell. The RNG signal has a probability of about 0.5 to switch the resistive state of the MRAM cell from a first resistive state corresponding to a first data state to a second resistive state corresponding to a second data sate. The first random bit is then read from the MRAM cell.

Magnetoresistive random-access memory (MRAM) random number generator (RNG) and a related method for generating a random bit

In some embodiments, the present application provides a method for manufacture a memory device. The method includes forming a multilayer stack including a first magnetic layer and a first dielectric layer and forming another magnetic layer. The multilayer stack and the another magnetic layer are tailored to meet dimensions of a package structure. The package structure includes a chip having a memory cell and an insulating material enveloping the chip, where an outer surface of the package structure comprises the insulating material. The tailored multilayer stack and the tailored another magnetic layer are attached to the outer surface of the package structure.

In some embodiments, a method for generating a random bit is provided. The method includes generating a first random bit by providing a random number generator (RNG) signal to a magnetoresistive random-access memory (MRAM) cell. The RNG signal has a probability of about 0.5 to switch the resistive state of the MRAM cell from a first resistive state corresponding to a first data state to a second resistive state corresponding to a second data state. The first random bit is then read from the MRAM cell.

The present disclosure provides a package structure, including a mounting pad having a mounting surface, a semiconductor chip disposed on the mounting surface of the mounting pad, wherein the semiconductor chip includes: a first surface perpendicular to a thickness direction of the semiconductor chip, a second surface opposite to the first surface and facing the mounting surface, and a third surface connecting the first surface and the second surface, a magnetic device disposed in the semiconductor chip, a first magnetic field shielding at least partially surrounding the third surface, a second magnetic field shielding, including a top surface facing the second surface of the semiconductor chip, and a molding surrounding the semiconductor chip, wherein the entire top surface of the second magnetic field shielding is in direct contact with the molding.

Devices and methods are provided in which a magnetic sensitive semiconductor chip, such as a magnetoresistive random-access memory (MRAM) chip, is shielded from magnetic interference by a magnetic shielding layer. A device includes a housing that defines an exterior surface. A semiconductor chip is disposed within the housing, and the semiconductor chip is spaced apart from the exterior surface of the housing. A magnetic shielding layer is spaced apart from the semiconductor chip by a distance less than 5 mm.

Devices and methods having magnetic shielding layer

A test apparatus includes a tray including at least a first region and a second region, and a cap disposed over the tray. The cap includes a cap body, and at least a first magnet and a second magnet disposed over the cap body. The first magnet is configured to provide a first magnetic field to the first region of the tray, and the second magnet is configured to provide a second magnetic field to the second region of the tray. A strength of the first magnetic field is different from a strength of the second magnetic field.

Test apparatus and testing method using the same

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Hsinchu, Taiwan

Chia-Hsiang Chen