Lite-on Technology Corporation

Silitek Electronic (guangzhou) Co., Ltd.

Chia-Hsi Tsai

Cheng-Te Tseng

Tzu-Kan Chen

Meng-Hsin Kuo

Yi-Ting Lin

Jin-Chern Chiou

Yung-Jiun Lin

A display device is applied to a light sensing system. The display device includes a display module and a pattern layer. The pattern layer is made of optical material and formatted on the display module. The pattern layer includes patterned optical material and gaps without optical material. The pattern layer selectively reflects or absorbs invisible light with specific wavelength emitted from the display module, such that a light sensor cannot sense the invisible light reflected or absorbed by the optical material or just can sense a little invisible light through the optical material. However, the invisible light can be emitted out of the gaps without the optical material, such that the light sensor can selectively sense the invisible light. Based on the light sensing result, the light sensor can recognize the corresponding pattern.

Display device and light sensing system

The optical image stabilizer includes a substrate, a carrier movably disposed above the substrate for carrying an image sensor, an anchor fixed above the substrate, a conducting pad fixed above the anchor for coupling an image processing circuit, a flexible suspension disposed between the conducting pad and the carrier, a conducting line disposed above the flexible suspension coupled to the conducting pad and protruding over the carrier for coupling the image sensor, and a micro-actuator disposed between the substrate and the carrier for adjusting the position of the carrier according to control signals from an actuator control circuit.

Micro-optical image stabilizer

An image capturing device includes a base formed with a first receiving space defined by a bottom wall and a first surrounding wall, and a second receiving space defined by a top side of the first surrounding wall and a second surrounding wall. A lens module is mounted on the base for generating an optical image of an object. An auto-focusing module is disposed in the second receiving space for auto-focusing the optical image based on an external voltage. A sensing module is mounted in the first receiving space and on the bottom wall of the base, is disposed under the auto-focusing module, and is spaced apart from the lens module at a predetermined distance for sensing the optical image focused by the auto-focusing module so as to generate an electrical output corresponding to the optical image.

Image capturing device

A micro-optical image stabilizer is disclosed. The optical image stabilizer includes a substrate, a carrier movably disposed on the substrate for carrying an image sensor, an anchor fixed on the substrate, a conducting pad fixed on the anchor for coupling an image processing circuit, a flexible suspension disposed between the conducting pad and the carrier, a conducting line disposed on the flexible suspension coupled to the conducting pad and protruding over the carrier for coupling the image sensor, and a micro actuator disposed between the substrate and the carrier for adjusting the position of the carrier according to control signals from an actuator control circuit.

The present invention provides a manufacturing method for a wafer lens module including the steps of providing a plastic material with high thermal resistance, wherein the high temperature plastic material can be used at a reflow temperature above 250&#x25a1;; and forming the high temperature plastic material into a wafer lens module integrally. The method can form an integrated wafer lens module and simplify the manufacturing procedures. Furthermore, a wafer lens unit formed by stacking another wafer lens module on the wafer lens module manufactured by the method can have improved optical image quality.

Manufacturing method for a wafer lens module and the structure thereof

A method for making lens modules includes the steps of: a) providing a wafer including an array of sensor chips; b) mounting a plurality of lens assemblies on the sensor chips, respectively, thereby defining a plurality of intersecting spacing grooves among the lens assemblies; c) forming substrate layer by filling in the spacing grooves with a resin material; and d) cutting the wafer and the substrate layer along intersecting cutting lines each extending along one of the spacing grooves and each intervening the lens assemblies, the substrate layer being divided into a plurality of barrels respectively surrounding the lens assemblies. A lens module made by the method is also disclosed.

Method for making camera modules and camera module made thereby

A camera module includes a lens barrel, a lens, a sensing element, and an electromagnetic shield. The lens barrel defines a receiving space. The lens is mounted in the receiving space. The sensing element is covered by the lens barrel, is disposed below the lens, and is spaced apart from the lens. The sensing element includes a top face, a bottom face, a side face extending between the top and bottom faces, a plurality of first conductors mounted on the bottom face, at least one second conductor mounted on one of the top, bottom, and side faces, and a grounding element having one end connected to one of the first conductors and the other end connected to the second conductor. The electromagnetic shield is coupled to the lens barrel and includes a grounding portion electrically connected to the second conductor.

Camera module and method for making the same

A method for making a camera module includes the steps of: (a) providing a mold with a mold cavity; (b) mounting at least a sensing element and a lens within the mold cavity in such a manner that the sensing element and the lens are spaced apart from each other; and (c) forming a camera barrel by injecting a molding material into the mold cavity and by molding the molding material over the sensing element and the lens.

Method for making a camera module and camera module made thereby

An image capturing device includes a base, a lens module, and an electrically conducting mechanism. The lens module includes a fixed lens set and a liquid lens disposed respectively in an adjusting seat with first and second through holes. The liquid lens has first and second electrode portions. The conducting mechanism includes first and second conducting members disposed respectively on outer and inner surfaces of a surrounding wall of the base, a third conducting member abutting against the first electrode portion and extending through the first through hole to contact the first conducting member, and a fourth conducting member abutting against the second electrode portion and extending through the second through hole to contact the second conducting member. When the adjusting seat is rotated relative to the base, the first and second electrode portions of the liquid lens are respectively and electrically connected to the first and second conducting members.

Growing community of inventors

Taipei, Taiwan

Chia-Hsi Tsai