Mediatek Corporation

Chia-Hao Yang

Li-Chun Tu

Tsung-Huang Chen

Hsing-Chih Liu

Ying-Chih Chen

Nan-Cheng Chen

Che-Ya Chou

Kun-Ting Hung

A semiconductor package is provided. The semiconductor package includes a carrier substrate having opposite first surface and second surface, and a chip stack disposed on the first surface of the carrier substrate. The chip stack includes a first semiconductor die, a second semiconductor die, and an interposer between the first semiconductor die and the second semiconductor die. The interposer transmits signals between the first semiconductor die and the second semiconductor die.

Semiconductor package incorporating redistribution layer interposer

A semiconductor package structure includes a base. A first die is mounted on the base. The first die includes a plurality of first pads arranged in a first tier, and a plurality of second pads arranged in a second tier. A second die is mounted on the base and includes a plurality of third pads with the first pad area, and a plurality of fourth pads with the second pad area, alternately arranged in a third tier. The second die also includes a first bonding wire having two terminals respectively coupled to one of the first pads and one of the fourth pads. The semiconductor package structure also includes a second bonding wire having two terminals respectively coupled to one of the third pads and one of the second pads.

Bonding pad arrangement design for multi-die semiconductor package structure

A wireless communication device including an integrated processing circuit, a first memory and a testing circuit is provided. The integrated processing circuit includes a processing unit capable of processing a wireless communication signal and a radio frequency (RF) unit capable of performing a conversion between a radio frequency (RF) signal and a baseband signal, wherein the wireless communication signal is one of the RF signal and the baseband signal. The first memory is coupled to the integrated processing circuit. The first memory is capable of storing data used by the processing unit. The testing circuit is coupled to the first memory, and is capable of testing the first memory for determining if the first memory is an effective memory. The RF unit is put in a first package, the first memory is put in a second package, and the first package and the second package are packaged in a single device.

Wireless communication device

A wireless communication device including an integrated processing circuit, a first memory and a testing circuit is provided. The integrated processing circuit includes a processing unit capable of processing a wireless communication signal and a radio frequency (RF) unit capable of performing a conversion between a radio frequency (RF) signal and a baseband signal, wherein the wireless communication signal is one of the RF signal and the baseband signal. The first memory is coupled to the integrated processing circuit. The first memory is capable of storing data used by the processing unit. The testing circuit is coupled to the first memory, and is capable of testing the first memory for determining if the first memory is an effective memory. The RF unit and the first memory are placed in a single module.

A semiconductor package structure includes a base. A first die is mounted on the base. The first die comprises a plurality of first pads with a first pad area arranged in a first tier. A plurality of second pads with a second pad area is arranged in a second tier. A second die is mounted on the base. The second die includes a plurality of third pads arranged in a third tier. A first bonding wire has two terminals respectively coupled to one of the first pads and one of the third pads. A second bonding wire has two terminals respectively coupled to one of the third pads and one of the second pads.

Bonding pad arrangment design for multi-die semiconductor package structure

A wireless communication device including an integrated processing circuit and a first memory is provided. The integrated processing circuit includes a processing unit capable of processing a wireless communication signal and a radio frequency (RF) unit capable of performing a conversion between a radio frequency (RF) signal and a baseband signal, wherein the wireless communication signal is one of the RF signal and the baseband signal. The first memory is coupled to the integrated processing circuit. The first memory is capable of storing data used by the processing unit, wherein the integrated processing circuit and the first memory are packaged in a single semiconductor package.

A wireless communication device including an integrated processing circuit and a first memory is provided. The integrated processing circuit includes a processing unit capable of processing a wireless communication signal and a radio frequency (RF) unit capable of performing a conversion between a radio frequency (RF) signal and a baseband signal, wherein the wireless communication signal is one or more of the RF signal and the baseband signal. The first memory is coupled to the integrated processing circuit. The first memory is capable of storing data used by the processing unit, wherein the RF unit and the first memory are packaged in a single semiconductor device.

The invention provides a semiconductor package structure. The semiconductor package structure includes a base. A first die is mounted on the base. The first die comprises a plurality of first pads with a first pad area arranged in a first tier. A plurality of second pads with a second pad area is arranged in a second tier. A second die is mounted on the base. The second die comprises a plurality of third pads with the first pad area and a plurality of fourth pads with the second pad area alternately arranged in a third tier. A first bonding wire has two terminals respectively coupled to one of the first pads and one of the fourth pads. A second bonding wire has two terminals respectively coupled to one of the third pads and one of the second pads.

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Hsinchu County, Taiwan

Chia-Hao Yang