Taiwan Semiconductor Manufacturing Comp. Ltd.

Chia-Chun Wu

Hui-Zhong Zhuang

Huai-Tei Yang

Jerry Chang Jui Kao

Yung-Chen Chien

Su-Yu Yeh

Xiangdong Chen

Jeng-Yang Pan

I-Wen Wang

Wen-Fang Tang

An IC device includes first and second power rails extending in a first direction and carrying one of a power supply or reference voltage, a third power rail extending between the first and second power rails and carrying the other of the power supply or reference voltage, and a plurality of transistors including first through fourth active areas extending between the first and second power rails, a plurality of gate structures extending perpendicularly to the first direction, and first and second conductive segments extending in the second direction across the third power rail. Each of the second and third active areas is adjacent to the third power rail, each of the first and second conductive segments is electrically connected to S/D structures in each of the second and third active areas, and the plurality of transistors is configured as one of an AOI, an OAI, or a four-input NAND gate.

IC logic device, layout, system, and method

A method for eliminating wafer breakage during a wafer transfer process in a grinding apparatus by a wafer transfer pad and an apparatus for conducting such method are disclosed. In the method, a surface of the vacuum pad, or the wafer transfer pad, that is formed of sintered ceramic is first cleaned by contacting a rotating brush and a spray of cleaning solvent. The invention further discloses an apparatus for eliminating wafer breakage during the wafer transfer process by a vacuum pad by incorporating a pressure regulating valve situated in the vacuum conduit such that a vacuum pressure applied can be regulated at a rate not higher than 30 psi/sec. to the surface of the wafer transfer pad.

Method and apparatus for eliminating wafer breakage during wafer transfer by a vacuum pad

Growing community of inventors

Hsinchu, Taiwan

Chia-Chun Wu