Asustek Computer Inc.

Asustek Company Inc.

Chia-Ching Niu

Cheng-Yu Wang

Ing-Jer Chiou

A heat dissipation method applied to an electronic device including an electronic component is provided. The heat dissipation method includes: sensing a temperature of an electronic component by the temperature sensor; determining whether the temperature of the electronic component is larger than a threshold temperature; determining a rotation speed rank corresponding to a basic rotation speed and intermittently accelerating the basic rotation speed in the rotation speed rank while the sensed temperature of the electronic device is larger than a threshold temperature.

Heat dissipation method and electronic device using the same

An electronic device includes an upper cover, a lower cover combined with the upper cover, and a heat conducting pillar. An accommodating space is formed by the upper cover and the lower cover. The heat conducting pillar is disposed in the accommodating space and physically connected with the upper cover and the lower cover to balance the temperature of the upper cover and the lower cover.

Growing community of inventors

Taipei, Taiwan

Chia-Ching Niu