Orient Semiconductor Electronics, Limited

Pegatron Corporation

Chia-Chieh Hu

Ning Huang

Hui-Pin Chen

Chung-Ming Chang

Feng-Chang Tu

Yung-Cheng Chuang

Fu Yu Huang

Hua Wen Chiang

Hsuan Jui Chang

Fu-Yu Huang

Wen-Lo Shieh

Wen-Long Leu

Hsuan-Jui Chang

Hua-Wen Chiang

Feng Chang Tu

Chung Ming Chang

Wen Lo Shieh

Wan Le Xie

Kai-Ling Lin

Chin-Chien Chang

The present disclosure provides an outdoor electronic device including a shell, electronic assemblies, a rod body and a blower fan. The electronic assemblies are arranged in the shell. The rod body is of a hollow structure and includes a first end and a second end which are reversely arranged; and the first end is connected to the shell. At least one part of the blower fan is arranged on the rod body and includes an air inlet port and an air outlet port. The air inlet port extends to a position close to the electronic assemblies in the shell. The air outlet port is positioned in the rod body and is closer to the second end than the air inlet port.

Outdoor electronic device

A semiconductor chip package with cooling arrangement includes a heat sink adapted for covering at least a semiconductor chip, characterized in that said heat sink has an inverted U-shaped cross section thereby forming a recess at an inner bottom thereof adapted for covering at least a semiconductor chip and a plurality of pins extending downwardly from a circumferential lower edge of said heat sink, each of said pins being formed with a neck, an enlarged head, and an open slot separating said neck and said enlarged head into two portions, whereby the package can rapidly remove heat from the semiconductor chip, filter noise and reduce inductance.

Semiconductor chip package with cooling arrangement

A device for making metal bumps includes a hard conical tubular member having a vertical conical passage at an upper portion thereof, a bell shaped chamber at a lower portion thereof which is larger than the vertical conical passage in diameter, located under and communicated with the vertical conical passage, and a circular recess which is larger than the bell shaped chamber in diameter, located under and communicated with the bell shaped chamber, thereby forming a capillary tube with a surface.

Method and device for making a metal bump with an increased height

A method of forming cylindrical bumps on a substrate for integrated circuits includes the steps of: forming copper circuits on a board of a substrate by means of electroplating; covering said board with a screening material; forming openings in said screening material to align with copper circuits on said board, filling pure copper or high melting point metal into said openings by electroplating to form cylindrical projections; forming a layer of solder alloy on an upper end of each of said cylindrical projections to be even with an upper surface of said screening material, and removing said screening material to leave the cylindrical bumps, whereby the engagement operation between the die and the substrate can be facilitated and the manufacture of the die can be easier.

Method of forming cylindrical bumps on a substrate for integrated circuits

A method of forming metal bumps on a wafer includes the steps of adhering a heat-resistant and steady synthetic tape on the top of the wafer, punching holes through the synthetic tape to form a blind hole on the synthetic tape above the under-bump-metallurgy layer (UBM), filling solder paste into the blind hole by a pusher, melting and then cooling the solder paste into a solder block removing the synthetic tape to expose the solder block, and melting the solder block to form a ball-shaped solder bump.

Method of forming bumps on wafers or substrates

A process of manufacturing thin ball array substrates includes the steps of: using a layer of polyimide film as a carrier, electroplating a thin copper layer on the polyimide film, electroplating a thick copper layer on the thin copper layer, applying photosensitive coating layers on both sides of the carrier, mounting two masks with optically transmissible circuit tracks on two sides of the carrier and then processing the carrier with exposure treatment, processing the carrier with development treatment so as to remove the photosensitive coating layers aligned with the circuit track thereby forming recessed circuit tracks on the photosensitive coating layers, electroplating a copper layer on a top of the carrier thereby forming an additional copper layer on the thick copper layer, etching a bottom of the carrier to remove the upper recessed circuit track thereon, coating the copper layer on the upper recessed circuit track with soldering metallic material so as to make a top of the soldering metallic material, washing away the photosensitive coating layers with chemical agent, and removing surplus copper layer to remain in circuit lines and the soldering metallic material, whereby a thin ball grid array substrate with thicker circuit lines without remaining electroplating lines can be obtained.

Process of manufacturing thin ball grid array substrates

Growing community of inventors

Taipei, Taiwan

Chia-Chieh Hu