Innolux Corporation

Red Oak Innovations, LLC

Chia-Chieh Fan

Ming-Tsang Wu

Cheng-Chi Wang

Hsueh-Hsuan Chou

Kuan-Jen Wang

Shan-Shan Hsu

Chin-Lung Ting

Li-Wei Sung

Yi-Hung Lin

Tong-Jung Wang

Jia-Sin Li

Ker-Yih Kao

Chi-Liang Chang

Hao-Jung Huang

Yun-Sheng Chen

I-Ho Shen

Wen-Chieh Lin

Pai-Chi Tsai

Chia-Yuan Chang

Chun-Sheng Yen

Chiao-Chu Tsui

Chih-Han Ma

An electronic device including an electronic unit and a functional unit is provided. The electronic unit includes a substrate, a plurality of semiconductor components, and a cover layer. The substrate has a plurality of first side surfaces. The semiconductor components are disposed on the substrate. The cover layer is disposed on the semiconductor components and has a plurality of second side surfaces. The functional unit is disposed on at least one of at least one of the first side surfaces and at least one of the second side surfaces.

Electronic device

An electronic device is provided. The electronic device includes a supporting board, multiple circuit boards, a gap, and a molding material. The circuit boards are disposed on the supporting board. Each circuit board includes a substrate and multiple semiconductor elements. The semiconductor elements are disposed on the substrate. The gap is disposed between two adjacent circuit boards. The molding material is disposed on the supporting board and covers the circuit boards and the gap. The electronic device of the embodiment of the disclosure can improve uniformity of product appearance or uniformity of a display image.

An electronic device including a substrate, a circuit structure, two adjacent supporting elements and another two adjacent supporting elements is provided. The flexible substrate has a first surface and comprises a region connected with a circuit board. The circuit structure is disposed on the first surface. The two adjacent supporting elements are disposed on the first surface and separated by a first distance. The another two adjacent supporting elements are disposed on the first surface and separated by a second distance, wherein the two adjacent support elements are farther away from the region than the another two adjacent support elements, and the first distance is less than the second distance.

The present disclosure provides a package device and a manufacturing method thereof. The package device includes an electronic device, a conductive pad having a first bottom surface, and a redistribution layer disposed between the conductive pad and the electronic device. The redistribution layer has a second bottom surface, and the conductive pad is electrically connected to the electronic device through the redistribution layer. The first bottom surface is closer to the electronic device than the second bottom in a normal direction of the electronic device.

Package device

An electronic device is provided. The electronic device includes a housing, a driving circuit assembly, an adhesive layer, and a flexible circuit board. The driving circuit assembly is disposed on the housing. The adhesive layer is disposed between the housing and the driving circuit assembly. The adhesive layer includes an opening. The flexible circuit board is electrically connected to the driving circuit assembly. The flexible circuit board overlaps the opening. The housing and the driving circuit assembly are connected to each other by the first adhesive segment and the second adhesive segment.

An electronic device including a flexible substrate, a plurality of light emitting units, and a plurality of supporting elements is provided. The flexible substrate has a first surface and a second surface opposite to each other. The light emitting units are disposed on the first surface. The supporting elements are disposed on the second surface. The supporting element includes an arc-shaped structure.

An electronic device is provided. The electronic device includes a backlight module, a display panel, an adhesive layer, and a flexible circuit board. The display panel is disposed on the backlight module. The adhesive layer is disposed between the backlight module and the display panel. The adhesive layer includes an opening. The flexible circuit board is electrically connected to the display panel. The flexible circuit board overlaps the opening.

A manufacturing method of semiconductor device includes providing a substrate, forming a sacrificial layer on the substrate, forming a resin layer on the sacrificial layer, disposing first chips on the sacrificial layer, and forming a first dielectric layer having trenches and surrounding the first chips, wherein an upper surface of the first dielectric layer and an upper surface of the resin layer are at a same plane.

Manufacturing method of semiconductor device

The present disclosure provides a package device including a conductive pad, a protecting block, and a redistribution layer. The protecting block is disposed on the conductive pad. The redistribution layer is disposed on the protecting block, and the conductive pad is electrically connected to the redistribution layer through the protecting block.

A manufacturing method of semiconductor device includes providing a substrate, forming a sacrificial layer on the substrate, disposing first chips on the sacrificial layer, forming a first dielectric layer surrounding the first chips, forming trenches in the first dielectric layer, and forming a second dielectric layer in the trenches, wherein an upper surface of the first dielectric layer and an upper surface of the second dielectric layer are at a same plane.

A display device including a liquid crystal display, light-emitting diode boards, a system board, and a flexible circuit board is provided. The plurality of light-emitting diode boards are disposed adjacent to the liquid crystal display and overlaps a peripheral region of the liquid crystal display in a normal direction of the display device. At least one of the light-emitting diode boards includes a carrier, light-emitting diodes, and connecting pads. The carrier has a first surface and a second surface opposite to the first surface and located between the first surface and the liquid crystal display. The light-emitting diodes are disposed on the first surface. The connecting pads are disposed on the second surface and are electrically connected to the light-emitting diodes. The system board is located below and electrically connected to the liquid crystal display. The system board is electrically connected to the connecting pads through the flexible circuit board.

Display device

A package structure includes a redistribution layer having a first surface, a second surface disposed opposite to the first surface, and at least one sidewall connected to the first surface and the second surface, at least one bonding electrode disposed on the first surface of the redistribution layer, and a mounting layer disposed on the second surface of the redistribution layer. The mounting layer includes a plurality of conductive pads that are spaced apart from each other. At least one of the conductive pads is exposed by the sidewall of the redistribution layer.

Package structure and manufacturing method thereof

A display device is provided and includes: a display panel; and a circuit board electrically connected to the display panel and including: a substrate; a first conductive layer disposed on the substrate and including a first connecting pad and a second connecting pad; a second conductive layer disposed on and electrically connected to the second connecting pad; a first electronic component disposed on and electrically connected to the first connecting pad; and a second electronic component disposed on the second conductive layer and electrically connected to the second connecting pad through the second conductive layer. The first connecting pad has a first thickness. A total thickness of the second connecting pad and the second conductive layer is a second thickness. The second thickness is greater than the first thickness. A ratio of the second thickness to the first thickness ranges from 1.2 to 5000.

Electronic device and display device comprising the same

A package structure includes a redistribution layer, at least one bonding electrode, and a mounting layer. The redistribution layer has a first surface, a second surface disposed opposite to the first surface, and at least one sidewall connected to the first surface and the second surface. The bonding electrode is disposed on the first surface of the redistribution layer. The mounting layer is disposed on the second surface of the redistribution layer. The mounting layer includes a plurality of conductive pads spaced apart from each other, wherein at least one of the conductive pads is exposed by the sidewall of the redistribution layer.

Growing community of inventors

Miao-Li County, Taiwan

Chia-Chieh Fan