Taiwan Semiconductor Manufacturing Comp. Ltd.

Chia-Chiang Chen

Shen-Ping Wang

Fei-Yuh Chen

Yuh-Hwa Chang

David Ho

Alan Lee

Ching-Heng Po

A method of forming a micromechanical structure, wherein at least one micromechanical structural layer is provided above a substrate. The micromechanical structural layer is sustained between a lower sacrificial silicon layer and an upper sacrificial silicon layer, wherein a metal silicide layer is formed between the lower and upper sacrificial silicon layers to increase interface adhesion therebetween. The upper sacrificial silicon layer, the metal silicide layer and the lower sacrificial silicon layer are then removed to release the micromechanical structural layer.

Method of foming a micromechanical structure

A micromirror for micro-electro-mechanical systems. The micromirror comprises a pad layer, a doped aluminum layer containing 0.002 wt % to 0.3 wt % of silicon overlying the pad layer and a protective layer overlying the doped aluminum layer.

Micromirrors for micro-electro-mechanical systems and methods of fabricating the same

A micromirror which includes a substrate, a reflective layer comprising pure aluminum overlying the substrate and a protective layer comprising titanium nitride overlying the reflective layer is disclosed.

Growing community of inventors

Shinchu, Taiwan

Chia-Chiang Chen